Manual Solder Paste Printer GSE-ET-105

Features :

Sturdy Metal and Aluminum Structure: Specifically designed for solder paste and red glue printing, providing durability and stability for consistent performance.
Manual Operation: Allows manual positioning, board placement, printing, and board removal, making it ideal for precise, hands-on control.
Flexible Location Modes: Features both side and hole-based location options, with four-sided micrometric adjustments to ensure accurate alignment between the stencil and PCB.
Adjustable Settings: Fully customizable, allowing for manual adjustments to meet a variety of printing requirements.
Adaptable for PCB Thicknesses: Accommodates PCB thicknesses up to 100mm, making it versatile for different positioning modules and board thicknesses.

Specifications :

Printing Area	Large 450 x 600mm
	Medium 310 x 410mm
	Small 240 x 300mm
Location Mode	By side
Setting Mode	Manual micromatic setting
Setting Direction	Forward and backward, left and right, up and down
Printing Precision	0.5mm pitch QTP

SEM Equipment Sdn. Bhd. Malaysia

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