Plasma enhanced chemical vapor deposition (PECVD) is a thin film growth technology that uses glow discharge (plasma) to react thin films containing gaseous substances.
This PECVD system uses microwave or radio-frequency plasma to enable precise and uniform thin-film deposition for advanced material applications. Designed for research and industrial use, it supports high-quality coatings such as SiO , Si N , diamond films, optical coatings, carbon nanotubes (CNT), SiC coatings, C/C composites, and graphene. The system delivers stable plasma performance, excellent film uniformity, and reliable process control, making it ideal for semiconductor, materials science, and advanced coating applications.
Technical Specifications
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Note: More specification can be customized according to customers’ requirements.
Optional Features: Power off when door opens, LCD touch screen, remote control, computer monitoring.
