Structural Frame for Chip Packaging Equipment

This structural frame is designed for use in chip sorting and inspection systems within the semiconductor industry, supporting high-performance chip sorting and integrated automatic detection for wafer-level packaging. Fabricated from premium sheet materials, the structure undergoes a complete production process including laser cutting, welding, CNC machining, powder coating, and precision assembly.

The frame is processed using Fangtong welding and gantry milling to ensure optimal structural integrity and dimensional accuracy.

Specifications:

• Part Size: 1000×2000×3000mm

• Flatness: 0.1mm

• Diagonal Tolerance: 0.5mm

Key Features:

• Supports chip sorting and automatic inspection operations

• Fabricated from high-quality sheet metal

• Excellent flatness and structural accuracy

• Ideal for wafer-level chip packaging systems

• Durable, corrosion-resistant powder-coated finish

Optimized for precision, stability, and cleanroom-ready performance in semiconductor manufacturing.