Precision Electronics Inspection

XT V Series X-ray and CT Systems

The XT V series enables insights into printed circuit board assemblies, components, or electrical devices in an intuitive, non-destructive inspection process. Designed to cope with ever-shrinking geometries and tighter quality standards, these systems accelerate throughput and improve product quality while reducing costs through high-resolution imaging and flexible 3D packaging analysis.

System Overview

Nikon Metrology’s XT V series are high-precision X-ray systems designed specifically for electronics production and failure analysis. They feature high-performance X-ray sources, ergonomic design, and advanced software to provide the sharpest images for identifying defects like Head-in-Pillow, cold joints, and BGA voids. With options for CT, these systems transform 2D inspection into comprehensive 3D volumetric analysis.

Core Technology

In-house Source: Nikon Metrology is the only manufacturer to produce its own X-ray sources, ensuring optimized performance and long-term reliability for demanding industrial environments.

Configuration Options

Source Type Open-tube Nano-focus
Detector FPD / 16-bit Imaging
Axis Control 5-Axis Manipulator
Compliance CE / Radiation Safety

Key Advantages

Real-time Imaging

The high-speed imaging chain allows for real-time visualization of internal structures, enabling immediate defect detection and process control.

Computed Tomography

Optional CT capability allows for 3D reconstruction, providing a deeper understanding of complex components and hidden solder joints.

Intuitive Operation

Easy-to-use software with automated inspection routines ensures high productivity for both experienced users and novices.

Multi-Axis Movement

Precision 5-axis manipulation enables views from any angle, essential for inspecting 3D packaging and multi-layered assemblies.

Technical Specifications

Feature	XT V 160	XT V 130C
X-ray Source
Max kV	160 kV	130 kV
Max. electron beam power	20 W	10 W
X-ray source	Open tube transmission target
Focal spot size	1 μm	3 μm
Feature recognition	500 nm	2 μm
Geometric magnification	2,046x
System magnification	Up to 36,000x
Imaging system	Varex 2520DX (2.85 Mpixel, 16-bit) Flatpanel Varex 1515DX (1.3 Mpixel, 16-bit) Flatpanel	Varex 1313DX (1 Mpixel, 16-bit) Flatpanel
Manipulator & System
Manipulator	5-axis (X, Y, Z, T, R)	4-axis (X, Y, Z, T)
Rotate axis	Included	Optional
Tilt	0 - 72 degrees
Measuring volume	Largest square in single map 406 x 406 mm (16 x 16") Maximum physical sample size 711 x 722 mm (28 x 30")
Max. sample weight	5 kg (11 lbs)
Enclosure, Controls & Software
Monitor	Single 4k IPS (3,840 x 2,160 pixels)
Cabinet dimensions (W x D x H)	1,200 x 1,786 x 1,916 mm (48.0 x 71.3 x 75.4")
Weight	2,100 kg (4,629 lbs)
Radiation safety	<1 μSv/hr at the cabinet surface
Control	Inspect-X control and analysis software
Automated inspection	Included	Optional
Computed Tomography / X.Tract	Optional
Primary applications	Real-time and automated electronics and semiconductor inspection, failure analysis	Real-time electronics inspection

Highlights

Precision Detection

Defect ID: Expertly identifies BGA voids, bridging, Head-in-Pillow, and wire bond defects (Au or Cu) in high-density electronics.

Reliability

Low Maintenance: Open-tube technology allows for filament replacement by the user, ensuring the lowest total cost of ownership.

Versatile Applications

Surface Mount Devices

Analysis of BGA, QFN, QFP, and CSP components for diameter, circularity, and voiding.

Through-Hole Inspection

Verification of solder filling in PTH, detecting cracks, and checking for bridging between pins.

IC Bonding

High-resolution inspection of gold or copper wire bonding, flip chip, and C4 connections.

Failure Analysis

Non-destructive characterization of electrical devices and multi-layer PCB assemblies.

XTV Electronic Series