ALPHA® CVP-390V is a premium, lead-free, no-clean solder paste engineered to deliver uncompromising electrochemical reliability for the most demanding electronics manufacturing applications. Its zero-halogen formulation ensures compliance with stringent environmental standards while providing a robust defense against current leakage and electrochemical migration, even in harsh operating conditions. This paste demonstrates best-in-class Surface Insulation Resistance (SIR), maintaining performance down to 0.100mm comb spacing, making it an ideal choice for high-density assemblies in automotive, aerospace, and next-generation telecommunications hardware.
Beyond its exceptional reliability, the CVP-390V offers remarkable manufacturing flexibility with a wide process window. It achieves a >2.00 CpK for transfer efficiency across a broad range of area ratios, ensuring consistent printing results from 01005 components to larger apertures. The paste provides excellent stencil life, tack life over 24 hours, and coalescence down to 170 µm features, supporting both ramp-and-soak and straight ramp reflow profiles in air or nitrogen atmospheres. With a clear, non-tacky residue that ensures excellent pin testability, ALPHA CVP-390V maximizes first-pass yields while eliminating the need for post-reflow cleaning.
Superior Electrochemical Reliability: Maintains >10 x Ohms SIR on 100µm spacing for high-reliability applications.
Wide Process Window: >2.0 Cpk transfer efficiency provides maximum manufacturing flexibility and consistency.
Zero-Halogen Formulation: Complies with RoHS and the strictest environmental standards for halogen-free electronics.
Fine Feature Capable: Excellent printing performance and coalescence down to 170 µm apertures.
No-Clean Convenience: Clear, non-tacky residue eliminates cleaning and ensures excellent testability.
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