Chemtronics Soder-Wick Rosin Flux Desoldering Braid represents the state of the art in solder removal technology, engineered to meet the demands of modern, heat-sensitive electronics. Its construction uses a lighter mass, pure copper braid that provides superior thermal conductivity, allowing it to respond faster than conventional braids. This efficiency enables effective desoldering at lower temperatures, minimizing the risk of overheating and preventing potential damage to delicate PCBs and components. The integrated Rosin (Type R) flux ensures the fastest desoldering action in the industry, quickly breaking down surface tension to wick away solder effortlessly.
Designed for professional and mission-critical applications, Soder-Wick complies with stringent industry standards including MIL-F-14256 and ANSI/IPC J-STD-004. To protect sensitive components during handling, it is packaged on static-dissipative bobbins that qualify per MIL-STD-1686. Available in multiple widths—color-coded for easy identification from 0.8mm to 5.3mm—it is ideal for everything from micro-circuits and SMT pads to large BGA pads. For optimal performance, it is recommended to clean the board after use with an approved flux remover to eliminate any residual flux.
Fast, Efficient Desoldering: Pure copper braid and rosin flux provide industry-leading wicking speed.
PCB-Safe Operation: Works at lower temperatures to prevent thermal damage to boards and components.
Static-Safe Packaging: Housed on static-dissipative bobbins to protect sensitive electronics.
Multiple Sizes: Six color-coded widths to match any pad size, from micro-circuits to BGA.
Industry Compliant: Meets MIL, NASA, and IPC standards for reliability and quality.
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