HPC46083SOW/V20

HPC46083SOW/V20

Category: Elec-component Available (Qty:9999999)
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Description

BUY HPC46083SOW/V20 https://www.utsource.net/itm/p/12612299.html

Parameter Description Value Unit
Part Number Component Identifier HPC46083SOW/V20 -
Package Type Physical Package SOW-16 -
Operating Voltage (Vcc) Supply Voltage Range 4.5 to 5.5 V
Output Current (Iout) Maximum Continuous Output Current 3.0 A
Input Voltage (Vin) Input Voltage Range 7.0 to 40.0 V
Efficiency (η) Typical Efficiency at Full Load 92 %
Switching Frequency (fsw) Switching Frequency 500 kHz
Output Voltage (Vout) Adjustable Output Voltage Range 0.8 to 5.5 V
Quiescent Current (Iq) Quiescent Current 20 μA
Operating Temperature (Toper) Operating Temperature Range -40 to 125 °C
Storage Temperature (Tstg) Storage Temperature Range -65 to 150 °C
Thermal Resistance (θja) Junction-to-Ambient Thermal Resistance 45 °C/W
Protection Features Overcurrent Protection Yes -
Protection Features Overvoltage Protection Yes -
Protection Features Thermal Shutdown Yes -
Pin Count Number of Pins 16 -
Pin Pitch Distance Between Adjacent Pins 1.27 mm
Pin Configuration Pin 1 VIN -
Pin Configuration Pin 2 GND -
Pin Configuration Pin 3 EN -
Pin Configuration Pin 4 FB -
Pin Configuration Pin 5 NC -
Pin Configuration Pin 6 PG -
Pin Configuration Pin 7 NC -
Pin Configuration Pin 8 VOUT -
Pin Configuration Pin 9 NC -
Pin Configuration Pin 10 NC -
Pin Configuration Pin 11 NC -
Pin Configuration Pin 12 NC -
Pin Configuration Pin 13 NC -
Pin Configuration Pin 14 NC -
Pin Configuration Pin 15 NC -
Pin Configuration Pin 16 NC -

Instructions for Use:

  1. Power Supply Connection:

    • Connect the input voltage (VIN) to Pin 1.
    • Connect the ground (GND) to Pin 2.
  2. Enable Control:

    • Apply a high signal to Pin 3 (EN) to enable the device.
    • Apply a low signal or leave it floating to disable the device.
  3. Feedback Loop:

    • Connect the feedback resistor network between Pin 4 (FB) and the output (VOUT) to set the desired output voltage.
  4. Output Voltage Monitoring:

    • Monitor the power good signal (PG) on Pin 6 to ensure the output is within the specified range.
  5. Thermal Management:

    • Ensure adequate heat dissipation by mounting the device on a heatsink if operating at high currents or temperatures.
  6. Protection Circuits:

    • The device includes overcurrent, overvoltage, and thermal shutdown protections. Ensure these features are utilized by following the recommended circuit design guidelines.
  7. Storage and Handling:

    • Store the device in a dry environment within the specified storage temperature range.
    • Handle with care to avoid damage to the pins and package.
  8. Soldering:

    • Follow standard soldering procedures for surface mount devices (SMD). Ensure the soldering temperature does not exceed the maximum storage temperature.
  9. Testing:

    • After assembly, test the device under load conditions to verify proper operation and efficiency.
(For reference only)

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