HD74LS293P: Top Choice in United States (USA) Utsource Holding Company Limited

Description

Parameter	Symbol	Min	Typ	Max	Unit	Description
Supply Voltage	V_CC	4.75	5.0	5.25	V	Operating supply voltage
Input Voltage (High)	V_IH	2.0	-	V_CC	V	Minimum input voltage for logic high
Input Voltage (Low)	V_IL	0	-	0.8	V	Maximum input voltage for logic low
Output Voltage (High)	V_OH	2.4	-	V_CC - 0.1	V	Minimum output voltage for logic high
Output Voltage (Low)	V_OL	0	-	0.4	V	Maximum output voltage for logic low
Input Current (High)	I_IH	-1	-	20	μA	Maximum current when input is high
Input Current (Low)	I_IL	-20	-	1	μA	Maximum current when input is low
Output Current (Source)	I_OH	-	-	0.4	mA	Maximum current sourced by output
Output Current (Sink)	I_OL	-8	-	-	mA	Maximum current sunk by output
Propagation Delay Time	t_p	16	-	35	ns	Time delay from input to output
Power Dissipation	P_D	-	-	100	mW	Maximum power dissipation per package
Operating Temperature	T_A	0	-	70	°C	Ambient operating temperature
Storage Temperature	T_STG	-65	-	150	°C	Temperature range for storage

Power Supply:
- Connect the V_CC pin to a 5V supply.
- Connect the GND pin to ground.
Input Signals:
- Ensure that input signals meet the specified V_IH and V_IL levels.
- Keep input currents within the specified limits to avoid damage.
Output Signals:
- Ensure that output signals are within the specified V_OH and V_OL levels.
- Do not exceed the maximum output current ratings to prevent damage to the device.
Propagation Delay:
- Account for the propagation delay time in your timing calculations to ensure proper operation.
Temperature Considerations:
- Operate the device within the specified ambient temperature range.
- Store the device within the specified storage temperature range to avoid degradation.
Handling:
- Handle the device with care to avoid static discharge, which can damage the internal circuits.
- Use appropriate ESD protection measures during handling and installation.
Mounting:
- Mount the device on a suitable PCB with proper soldering techniques to ensure reliable connections.
- Ensure good thermal management if the device is expected to dissipate significant power.
Testing:
- Test the device under typical operating conditions to verify its functionality.
- Refer to the datasheet for specific test procedures and recommended test setups.

(For reference only)