MC33886VW
MC33886VW

 

MC33886VW

Utsource Holding Company Limited flag
Category: Available (Qty:9999999)
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Description

BUY MC33886VW https://www.utsource.net/itm/p/1557036.html
5.0 A H BRIDGE

Parameter Symbol Min Typ Max Unit Conditions
Supply Voltage VCC 4.5 12 40 V -
Output Current (per channel) IOUT - 2.5 3 A Continuous, TA = 25°C
Peak Output Current (per channel) IPEAK - 5 5.5 A Pulse, TA = 25°C, tpulse ≤ 1 ms
Quiescent Current IQ - 20 40 mA VCC = 12V, No Load
Thermal Shutdown Temperature TSD - 170 - °C -
Operating Temperature Range TA -40 - 125 °C -
Storage Temperature Range TSTG -65 - 150 °C -
Input Voltage Range for Logic Control VIN 0 - 5 V -
Maximum Junction Temperature TJ(max) - 150 - °C -
Thermal Resistance (Junction to Ambient) RθJA - 35 - °C/W -

Instructions for Using MC33886VW

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the range of 4.5V to 40V.
    • Use a stable power source to avoid voltage fluctuations that can affect performance.

  2. Output Current:

    • The continuous output current per channel should not exceed 3A at room temperature (25°C).
    • For pulse applications, the peak current can go up to 5.5A, but ensure the pulse duration does not exceed 1ms.

  3. Quiescent Current:

    • The quiescent current is typically around 20mA and can go up to 40mA when the supply voltage is 12V with no load.

  4. Thermal Management:

    • Monitor the thermal shutdown temperature (TSD) which is typically around 170°C to prevent damage from overheating.
    • Use appropriate heat sinks or cooling methods if operating in high-temperature environments.

  5. Operating Temperature:

    • The device can operate in temperatures ranging from -40°C to 125°C.
    • Store the device in temperatures between -65°C and 150°C.

  6. Logic Control:

    • The input voltage for logic control (VIN) should be within the range of 0V to 5V.
    • Ensure the logic signals are clean and stable to avoid misoperation.

  7. Maximum Junction Temperature:

    • Do not exceed the maximum junction temperature of 150°C to prevent permanent damage to the device.

  8. Thermal Resistance:

    • The thermal resistance (RθJA) is approximately 35°C/W. This value helps in calculating the required heat dissipation for the device.

  9. Installation and Handling:

    • Follow standard ESD (Electrostatic Discharge) precautions during installation and handling to avoid damage to the device.
    • Ensure proper soldering techniques to avoid thermal stress on the device.

  10. Testing and Troubleshooting:

    • Regularly test the device under different conditions to ensure it meets the specified parameters.
    • If issues arise, refer to the datasheet for troubleshooting tips and contact the manufacturer for further assistance.
(For reference only)

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