74ACT16245DL
74ACT16245DL

 

74ACT16245DL

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Category: Available (Qty:9999999)
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Description

BUY 74ACT16245DL https://www.utsource.net/itm/p/11653700.html

Parameter Symbol Min Typ Max Unit Conditions
Supply Voltage VCC 1.65 - 3.6 V -
Output High-Level Voltage VOH - - VCC - 0.1 V IOL = -4 mA, VCC = 3.3 V
Output Low-Level Voltage VOL 0 - 0.2 V IOL = 8 mA, VCC = 3.3 V
Input High-Level Voltage VIH 2.0 - VCC V -
Input Low-Level Voltage VIL 0 - 0.8 V -
Input Leakage Current IIL -1 - 1 μA VIN = 0 V or VCC
Output Leakage Current IOL -1 - 1 μA VOUT = 0 V or VCC
Propagation Delay Time tpd 2.5 3.5 5.0 ns VCC = 3.3 V, TA = 25°C, CL = 15 pF
Power Dissipation PD - - 330 mW Per Package
Operating Temperature Range TA -40 - 85 °C -
Storage Temperature Range TSTG -65 - 150 °C -

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the range of 1.65 V to 3.6 V.
    • Connect VCC to the power supply and GND to ground.

  2. Input and Output Levels:

    • For proper operation, input signals should be within the specified high (VIH) and low (VIL) levels.
    • Output signals will be within the specified high (VOH) and low (VOL) levels.

  3. Current Limits:

    • Do not exceed the maximum output current ratings to avoid damage to the device.
    • Ensure that the input leakage current (IIL) and output leakage current (IOL) are within the specified limits.

  4. Propagation Delay:

    • The propagation delay time (tpd) is crucial for timing considerations in your circuit. Ensure that your design accounts for this delay.

  5. Temperature:

    • The device is designed to operate within the temperature range of -40°C to 85°C. Store the device within the storage temperature range of -65°C to 150°C.

  6. Power Dissipation:

    • The maximum power dissipation per package is 330 mW. Ensure adequate heat dissipation if operating near this limit.

  7. Handling:

    • Handle the device with care to avoid static discharge, which can damage the IC.
    • Follow standard ESD (Electrostatic Discharge) precautions when handling and installing the device.

  8. Pin Configuration:

    • Refer to the datasheet for the specific pin configuration and ensure correct connections to avoid damage.

  9. Testing:

    • Before finalizing the design, test the device under various conditions to ensure it meets the required performance specifications.
(For reference only)

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