74HC574N

74HC574N

Category: Available (Qty:9999999)
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Description

BUY 74HC574N https://www.utsource.net/itm/p/11653723.html

Parameter Symbol Min Typ Max Unit Conditions
Supply Voltage VCC 2.0 - 6.0 V
Input Voltage (High) VIH 3.15 - VCC V VIL < VIH < VCC
Input Voltage (Low) VIL 0 - 0.85 V VIL < VIH < VCC
Output Voltage (High) VOH 2.4 - VCC-0.1 V IO = -4mA
Output Voltage (Low) VOL 0 - 0.1 V IO = 4mA
Input Current (High) IIH - 1 20 μA VI = VCC
Input Current (Low) IIL -1 - - μA VI = 0V
Output Current (High) IOH - - -4 mA VO = VCC-1.5V
Output Current (Low) IOL 4 - - mA VO = 0.5V
Propagation Delay Time tpd - 25 70 ns VCC = 5V, TA = 25°C
Power Dissipation PD - - 100 mW Per Package
Operating Temperature TA -40 - 85 °C
Storage Temperature TSTG -65 - 150 °C

Instructions for Use:

  1. Power Supply:

    • Connect the VCC pin to a supply voltage between 2.0V and 6.0V.
    • Ground the GND pin.
  2. Input Signals:

    • Apply logic high (VIH) or low (VIL) signals to the data input pins (D0-D7).
    • Ensure the input voltages are within the specified range to avoid damage.
  3. Output Signals:

    • The output pins (Q0-Q7) will reflect the state of the input pins when the clock (CP) is active.
    • Ensure the load on the output pins does not exceed the maximum output current ratings.
  4. Clock Signal:

    • The latch enable (LE) pin must be high for the data to be transferred from the input to the output.
    • The clock (CP) signal should be used to control the timing of the data transfer.
  5. Operating Temperature:

    • Operate the device within the temperature range of -40°C to 85°C to ensure reliable performance.
  6. Storage Temperature:

    • Store the device in an environment with temperatures ranging from -65°C to 150°C to prevent damage.
  7. Handling:

    • Handle the device with care to avoid static discharge and physical damage.
    • Follow proper ESD (Electrostatic Discharge) precautions when handling the device.
  8. Testing:

    • Before integrating the 74HC574N into your circuit, test it using a simple test setup to ensure it functions correctly.
  9. Layout Considerations:

    • Place the device close to other components to minimize signal trace lengths and reduce noise.
    • Use decoupling capacitors (e.g., 0.1μF) near the power supply pins to filter out noise.
  10. Power Dissipation:

    • Ensure the total power dissipation does not exceed 100mW to avoid overheating.
    • If necessary, use heat sinks or other cooling methods to manage thermal dissipation.
(For reference only)

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