CD4512BF: Top Choice in United States (USA) Utsource Holding Company Limited

Description

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Supply Voltage	V_CC	3	-	18	V	-
Input Low Voltage	V_IL	-	0.8	2.0	V	V_CC = 5V
Input High Voltage	V_IH	3.0	-	V_CC	V	V_CC = 5V
Output Low Voltage	V_OL	0.1	-	0.6	V	I_OL = 16mA, V_CC = 5V
Output High Voltage	V_OH	2.4	-	V_CC-0.5	V	I_OH = -0.4mA, V_CC = 5V
Propagation Delay Time	t_pd	-	27	95	ns	V_CC = 5V, f = 10MHz
Power Dissipation	P_D	-	-	500	mW	Per Package
Operating Temperature	T_A	-40	-	85	°C	-
Storage Temperature	T_STG	-65	-	150	°C	-

Power Supply:
- Ensure the supply voltage (V_CC) is within the specified range (3V to 18V).
- Connect the ground (GND) pin to a stable ground reference.
Input Signals:
- Input signals should be within the valid input voltage range.
- For V_CC = 5V, input low (V_IL) should be less than 2.0V, and input high (V_IH) should be greater than 3.0V.
Output Signals:
- When the output is low (V_OL), it should not exceed 0.6V when sourcing 16mA.
- When the output is high (V_OH), it should be at least 2.4V when sinking 0.4mA.
Propagation Delay:
- The propagation delay time (t_pd) is the time it takes for the output to change state after the input changes. It is typically 27ns at V_CC = 5V and f = 10MHz.
Thermal Management:
- Ensure the device operates within the specified temperature ranges to avoid damage.
- The operating temperature (T_A) should be between -40°C and 85°C.
- The storage temperature (T_STG) should be between -65°C and 150°C.
Power Dissipation:
- The maximum power dissipation per package is 500mW. Ensure adequate heat sinking if operating near this limit.
Handling:
- Handle the device with care to avoid static discharge which can damage the IC.
- Follow proper soldering techniques to ensure reliable connections.

(For reference only)