TLP520

TLP520

Category: Available (Qty:9999999)
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Description

BUY TLP520 https://www.utsource.net/itm/p/63411.html
programmable controllers ac/dc-input module solid state relay

Parameter Symbol Min Typ Max Unit Conditions
Forward Voltage VF - 1.2 1.6 V IF = 20 mA
Peak Forward Current IF(P) - - 100 mA t < 1 ms
Continuous Forward Current IF - - 20 mA
Reverse Voltage VR - - 5 V
Reverse Current IR - 0.1 1 μA VR = 5 V
Output Current (Low) IOL 4.5 8 12 mA VCE = 3 V, IF = 20 mA
Output Voltage (High) VOH - - 0.5 V IOL = 4.5 mA, IF = 20 mA
Propagation Delay Time tPLH, tPHL - 1.5 4.5 μs IF = 20 mA, VCC = 5 V, RL = 300 Ω
Storage Temperature TSTG -40 - 100 °C
Operating Temperature TA -40 - 85 °C

Instructions for Use:

  1. Power Supply:

    • Ensure the power supply voltage (VCC) is within the specified range to avoid damage to the device.
  2. Forward Current:

    • Do not exceed the maximum continuous forward current (IF) of 20 mA to prevent overheating and potential failure.
    • For pulse applications, the peak forward current (IF(P)) can be up to 100 mA, but ensure the pulse width does not exceed 1 ms.
  3. Reverse Voltage:

    • The device can withstand a reverse voltage (VR) up to 5 V. Exceeding this value can cause damage.
  4. Output Configuration:

    • When the output is low, the output current (IOL) should be between 4.5 mA and 12 mA to ensure proper operation.
    • When the output is high, the output voltage (VOH) should not exceed 0.5 V to maintain logic levels.
  5. Propagation Delay:

    • The propagation delay time (tPLH, tPHL) is typically 1.5 μs under standard conditions. This should be considered in timing-sensitive applications.
  6. Temperature Range:

    • The storage temperature (TSTG) ranges from -40°C to 100°C.
    • The operating temperature (TA) ranges from -40°C to 85°C. Ensure the device operates within these limits to avoid thermal stress.
  7. Mounting and Handling:

    • Handle the device with care to avoid static discharge, which can damage sensitive components.
    • Follow proper soldering techniques to ensure reliable connections without causing thermal shock to the device.
  8. Storage:

    • Store the device in a dry, cool place away from direct sunlight and extreme temperatures to maintain its performance and longevity.
(For reference only)

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