TLP590B
TLP590B

 

TLP590B

Utsource Holding Company Limited flag
Category: Available (Qty:9999999)
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Description

BUY TLP590B https://www.utsource.net/itm/p/324908.html
Optoelectronic Device:Other, SPECIALTY OPTOELECTRONIC DEVICE, PLASTIC, DIP-6/5

Parameter Symbol Min Typ Max Unit Conditions
Forward Voltage VF - 1.2 1.6 V IF = 10 mA
Peak Forward Current IF(peak) - - 100 mA Pulse Width ≤ 1 ms, Duty Cycle ≤ 2%
Continuous Forward Current IF - - 30 mA
Reverse Breakdown Voltage VBR(R) 5 - 7 V IR = 10 μA
Reverse Leakage Current IR - 100 500 nA VR = 5 V
Output Current IC - - 100 mA VCE(sat) = 1.5 V
Collector-Emitter Saturation Voltage VCE(sat) - 1.5 2.0 V IC = 100 mA, IF = 10 mA
Turn-On Time ton - 1.5 4.0 μs IF = 10 mA, RL = 1 kΩ, VCC = 5 V
Turn-Off Time toff - 1.5 4.0 μs IF = 10 mA, RL = 1 kΩ, VCC = 5 V
Storage Temperature Range TSTG -40 - 105 °C
Operating Temperature Range TA -40 - 85 °C

Instructions for Use:

  1. Forward Current (IF):

    • Ensure that the forward current does not exceed 30 mA continuously.
    • For short pulses, the peak forward current can be up to 100 mA, but ensure the pulse width is ≤ 1 ms and the duty cycle is ≤ 2%.

  2. Reverse Voltage (VBR(R)):

    • The reverse breakdown voltage should not exceed 7 V to avoid damage.

  3. Output Current (IC):

    • The maximum output current should not exceed 100 mA to prevent overheating and potential damage.

  4. Collector-Emitter Saturation Voltage (VCE(sat)):

    • Ensure that the collector-emitter saturation voltage is within the specified range to maintain efficient operation.

  5. Turn-On and Turn-Off Times:

    • The turn-on and turn-off times are critical for high-speed applications. Ensure that the circuit design accommodates these times to avoid timing issues.

  6. Temperature Considerations:

    • The device can operate over a wide temperature range from -40°C to 85°C. For storage, the temperature range is -40°C to 105°C.

  7. Handling and Storage:

    • Handle the device with care to avoid static discharge and physical damage.
    • Store the device in a dry, cool place to prevent moisture damage.

  8. Mounting:

    • Ensure proper mounting to maintain thermal performance and mechanical stability. Use appropriate heatsinks if necessary.

  9. Testing:

    • Before finalizing the design, conduct thorough testing under various conditions to ensure reliable operation.
(For reference only)

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