Description
BUY TLP260J https://www.utsource.net/itm/p/496607.html
Optocoupler - Trigger Device Output, 1 CHANNEL TRIAC OUTPUT OPTOCOUPLER, MINIFLAT, 11-4C1, 6/4 PIN
| Parameter |
Symbol |
Min |
Typ |
Max |
Unit |
| Supply Voltage |
VCC |
4.5 |
5.0 |
5.5 |
V |
| Input Current |
IF |
10 |
- |
20 |
mA |
| Output Current (Max) |
IOUT |
- |
- |
100 |
mA |
| Propagation Delay Time |
tPD |
0.5 |
- |
1.5 |
μs |
| Rise Time |
tr |
0.2 |
- |
0.6 |
μs |
| Fall Time |
tf |
0.2 |
- |
0.6 |
μs |
| Isolation Voltage |
VIORM |
- |
- |
3750 |
Vrms |
| Operating Temperature |
TOPR |
-40 |
- |
85 |
°C |
| Storage Temperature |
TSTG |
-55 |
- |
125 |
°C |
Instructions for Use:
Supply Voltage (VCC):
- Ensure the supply voltage is within the range of 4.5V to 5.5V to avoid damage to the device.
Input Current (IF):
- The input current should be between 10mA and 20mA to ensure reliable operation.
Output Current (IOUT):
- The maximum output current is 100mA. Do not exceed this limit to prevent overheating or damage.
Propagation Delay Time (tPD):
- The propagation delay time is typically between 0.5μs and 1.5μs. This is the time it takes for the output to respond to a change in the input signal.
Rise Time (tr) and Fall Time (tf):
- The rise and fall times are both between 0.2μs and 0.6μs. These parameters indicate how quickly the output can transition between states.
Isolation Voltage (VIORM):
- The device provides isolation up to 3750Vrms. Ensure that the isolation voltage is not exceeded to maintain safety and functionality.
Operating Temperature (TOPR):
- The operating temperature range is from -40°C to 85°C. Avoid operating the device outside this range to prevent performance degradation or failure.
Storage Temperature (TSTG):
- The storage temperature range is from -55°C to 125°C. Store the device within this range to ensure long-term reliability.
Handling:
- Handle the device with care to avoid static discharge, which can damage the internal components.
- Follow proper soldering techniques to ensure good electrical connections and prevent thermal stress.
Mounting:
- Ensure the device is mounted on a suitable PCB with appropriate heat dissipation if high currents are expected.
- Use recommended footprints and soldering profiles to ensure reliable mechanical and electrical connections.
(For reference only)
More detail about Utsource Holding Company Limited