TLP260J

TLP260J

Category: Available (Qty:9999999)
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Description

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Optocoupler - Trigger Device Output, 1 CHANNEL TRIAC OUTPUT OPTOCOUPLER, MINIFLAT, 11-4C1, 6/4 PIN

Parameter Symbol Min Typ Max Unit
Supply Voltage VCC 4.5 5.0 5.5 V
Input Current IF 10 - 20 mA
Output Current (Max) IOUT - - 100 mA
Propagation Delay Time tPD 0.5 - 1.5 μs
Rise Time tr 0.2 - 0.6 μs
Fall Time tf 0.2 - 0.6 μs
Isolation Voltage VIORM - - 3750 Vrms
Operating Temperature TOPR -40 - 85 °C
Storage Temperature TSTG -55 - 125 °C

Instructions for Use:

  1. Supply Voltage (VCC):

    • Ensure the supply voltage is within the range of 4.5V to 5.5V to avoid damage to the device.
  2. Input Current (IF):

    • The input current should be between 10mA and 20mA to ensure reliable operation.
  3. Output Current (IOUT):

    • The maximum output current is 100mA. Do not exceed this limit to prevent overheating or damage.
  4. Propagation Delay Time (tPD):

    • The propagation delay time is typically between 0.5μs and 1.5μs. This is the time it takes for the output to respond to a change in the input signal.
  5. Rise Time (tr) and Fall Time (tf):

    • The rise and fall times are both between 0.2μs and 0.6μs. These parameters indicate how quickly the output can transition between states.
  6. Isolation Voltage (VIORM):

    • The device provides isolation up to 3750Vrms. Ensure that the isolation voltage is not exceeded to maintain safety and functionality.
  7. Operating Temperature (TOPR):

    • The operating temperature range is from -40°C to 85°C. Avoid operating the device outside this range to prevent performance degradation or failure.
  8. Storage Temperature (TSTG):

    • The storage temperature range is from -55°C to 125°C. Store the device within this range to ensure long-term reliability.
  9. Handling:

    • Handle the device with care to avoid static discharge, which can damage the internal components.
    • Follow proper soldering techniques to ensure good electrical connections and prevent thermal stress.
  10. Mounting:

    • Ensure the device is mounted on a suitable PCB with appropriate heat dissipation if high currents are expected.
    • Use recommended footprints and soldering profiles to ensure reliable mechanical and electrical connections.
(For reference only)

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