HCPL-2300-000E

HCPL-2300-000E

Category: Available (Qty:9999999)
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Description

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HIGH SPEED-10 MBit/s LOGIC GATE OPTOCOUPLERS

Parameter Symbol Min Typ Max Unit Conditions
Input Current (Forward) IF - 20 50 mA VF = 1.2V at IF = 20mA
Input Voltage (Forward) VF 1.1 1.2 1.3 V IF = 20mA
Input Voltage (Reverse) VRRM - - 5 V Non-repetitive peak
Output Current (Collector) IC - 15 20 mA VCE = 5V, RL = 300Ω
Output Voltage (Collector-Emitter Saturation) VCE(sat) 0.2 0.4 0.6 V IC = 15mA, VCE = 5V
Isolation Voltage VIORM - - 2500 VRMS 1 minute, 50/60Hz
Propagation Delay Time tPLH, tPHL - 5 7 μs VCC = 5V, IF = 20mA, IC = 15mA
Storage Temperature TSTG -40 - 85 °C -
Operating Temperature TA 0 - 70 °C -

Instructions for Use:

  1. Power Supply:

    • Ensure that the supply voltage (VCC) is within the specified range (typically 4.5V to 20V).
    • Connect the supply voltage to the VCC pin and ground (GND) to the appropriate terminals.
  2. Input Side:

    • Apply the input current (IF) to the LED side of the optocoupler.
    • The forward voltage (VF) should be within the specified range (1.1V to 1.3V at 20mA).
    • Ensure that the reverse voltage (VRRM) does not exceed 5V.
  3. Output Side:

    • Connect the load resistor (RL) between the collector (C) and the positive supply.
    • The output current (IC) should not exceed 20mA.
    • The collector-emitter saturation voltage (VCE(sat)) should be monitored to ensure it remains within the specified range (0.2V to 0.6V).
  4. Isolation:

    • The device provides electrical isolation up to 2500VRMS for 1 minute at 50/60Hz.
    • Ensure that the isolation requirements of your application are met.
  5. Temperature:

    • Store the device in an environment where the temperature ranges from -40°C to 85°C.
    • Operate the device within the temperature range of 0°C to 70°C to ensure reliable performance.
  6. Propagation Delay:

    • The propagation delay time (tPLH, tPHL) should be considered when designing timing circuits. It typically ranges from 5μs to 7μs under standard conditions.
  7. Handling:

    • Handle the device with care to avoid damage to the pins and internal components.
    • Follow proper ESD (Electrostatic Discharge) precautions to prevent damage from static electricity.
  8. Mounting:

    • Solder the device to the PCB using recommended soldering temperatures and times to avoid thermal stress.
    • Ensure that the device is securely mounted and all connections are properly made.
(For reference only)

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