Description
BUY TLP520-4 https://www.utsource.net/itm/p/1370107.html
Interface IC/Device Data Book (Japanese)
| Parameter |
Symbol |
Conditions |
Min |
Typ |
Max |
Unit |
| Forward Voltage |
VF |
IF = 10 mA |
1.0 |
1.3 |
1.6 |
V |
| Reverse Breakdown Voltage |
VBR |
IR = 1 mA |
- |
- |
5.0 |
V |
| Peak Pulse Current |
IFPK |
tP = 1 ms |
- |
- |
100 |
mA |
| Output Leakage Current |
IOL |
VCE = 5 V, TA = 25°C |
- |
0.1 |
1.0 |
μA |
| Collector-Emitter Breakdown Voltage |
V(BR)CEO |
IC = 5 mA, IF = 0 mA |
- |
- |
30 |
V |
| Maximum Operating Temperature |
TOP |
Continuous operation |
-40 |
- |
85 |
°C |
| Storage Temperature |
TS |
Storage |
-40 |
- |
125 |
°C |
Instructions for Use:
Forward Voltage (VF):
- Ensure the forward voltage across the LED does not exceed the maximum specified value to avoid damage.
- Use a current-limiting resistor to maintain the forward current within the recommended range.
Reverse Breakdown Voltage (VBR):
- Do not apply reverse voltage beyond the specified limit to prevent breakdown and potential failure.
Peak Pulse Current (IFPK):
- The peak pulse current should not exceed the maximum rating to avoid overheating and damage.
- Ensure that the pulse duration is within the specified limits.
Output Leakage Current (IOL):
- The output leakage current can affect the performance of the circuit. Ensure that the load resistance is sufficient to handle this leakage.
Collector-Emitter Breakdown Voltage (V(BR)CEO):
- The collector-emitter voltage should not exceed the maximum breakdown voltage to prevent damage to the device.
Maximum Operating Temperature (TOP):
- Operate the device within the specified temperature range to ensure reliable performance and longevity.
Storage Temperature (TS):
- Store the device in an environment within the specified storage temperature range to prevent damage from extreme temperatures.
Handling Precautions:
- Handle the device with care to avoid mechanical damage.
- Follow proper ESD (Electrostatic Discharge) handling procedures to prevent damage from static electricity.
Mounting:
- Ensure proper mounting and soldering techniques to avoid thermal and mechanical stress on the device.
- Use appropriate soldering temperatures and times to prevent damage during assembly.
Testing:
- Test the device under controlled conditions to verify its performance and ensure it meets the required specifications.
(For reference only)
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