TLP759(J,F)

TLP759(J,F)

Category: Available (Qty:9999999)
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Description

BUY TLP759(J,F) https://www.utsource.net/itm/p/6493310.html
Optocoupler DC-IN 1-CH Transistor With Base DC-OUT 8-Pin PDIP (Alt: TLP759JF)

Parameter Symbol Min Typ Max Unit Conditions
Forward Voltage VF - 1.2 1.6 V IF = 20 mA, TA = 25°C
Peak Forward Current IF(PK) - - 30 mA tP = 1 ms, IF(AV) = 20 mA
Continuous Forward Current IF(AV) - - 20 mA TA = 25°C
Reverse Voltage VR - - 5 V IR = 10 μA, TA = 25°C
Output Current (Low Level) IOL - 8 16 mA VCC = 5 V, RL = 500 Ω, VO = 0.4 V
Output Voltage (High Level) VOH 2.4 3.6 4.4 V VCC = 5 V, IL = 0.4 mA, VI = 0 V
Propagation Delay Time tPLH, tPHL - 10 30 ns VCC = 5 V, IF = 20 mA, IL = 10 mA, VI = 5 V, VO = 0.4 V or 2.4 V
Storage Temperature Range TSTG -40 - 105 °C -
Operating Temperature Range TA -40 - 85 °C -

Instructions for Use:

  1. Forward Current (IF):

    • Ensure that the forward current does not exceed 20 mA continuously to avoid damaging the device.
    • For short pulses, the peak forward current can be up to 30 mA with a pulse width of 1 ms.
  2. Reverse Voltage (VR):

    • The device can withstand a reverse voltage of up to 5 V without exceeding a reverse leakage current of 10 μA.
  3. Output Current (IOL):

    • When the output is low, the device can sink up to 16 mA at VCC = 5 V and RL = 500 Ω.
  4. Output Voltage (VOH):

    • When the output is high, the voltage level should be between 2.4 V and 4.4 V at VCC = 5 V and IL = 0.4 mA.
  5. Propagation Delay Time:

    • The propagation delay time from input to output should be considered when designing circuits to ensure proper timing.
  6. Temperature Ranges:

    • Store the device within the temperature range of -40°C to 105°C.
    • Operate the device within the temperature range of -40°C to 85°C to ensure reliable performance.
  7. Mounting and Handling:

    • Handle the device with care to avoid mechanical stress.
    • Follow standard ESD (Electrostatic Discharge) precautions to prevent damage to the device.
  8. Soldering:

    • Use appropriate soldering techniques and temperatures to avoid thermal damage to the device.
  9. Testing:

    • Test the device under specified conditions to ensure it meets the required parameters before integrating it into your application.
(For reference only)

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