HCPL-7860P-500E

HCPL-7860P-500E

Category: Available (Qty:9999999)
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Description

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Parameter Symbol Min Typ Max Unit
Supply Voltage VCC 4.5 5.0 5.5 V
Output High Voltage VOH - 3.8 - V (at IOL = 16 mA)
Output Low Voltage VOL - 0.2 - V (at IOL = 16 mA)
Input Current IF 10 20 50 mA
Propagation Delay Time tpd 0.3 0.5 0.7 μs
Rise Time tr - 0.1 - μs
Fall Time tf - 0.1 - μs
Isolation Voltage VIORM - - 5000 VRMS
Operating Temperature TOP -40 - 105 °C
Storage Temperature TSTG -55 - 125 °C

Instructions for HCPL-7860P-500E

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the range of 4.5V to 5.5V.
    • Connect the VCC pin to a stable power source.
  2. Input Signal:

    • Apply the input current (IF) to the input pin, ensuring it is between 10mA and 50mA.
    • The input signal should be a logic level signal compatible with the specified input current range.
  3. Output Signal:

    • The output high voltage (VOH) will be approximately 3.8V when the output is high.
    • The output low voltage (VOL) will be approximately 0.2V when the output is low.
    • Ensure the load connected to the output can handle the specified output voltages and currents.
  4. Propagation Delay:

    • The propagation delay time (tpd) is the time it takes for the output to respond to a change in the input signal. It ranges from 0.3μs to 0.7μs.
  5. Rise and Fall Times:

    • The rise time (tr) and fall time (tf) are both typically 0.1μs, indicating fast switching times.
  6. Isolation:

    • The device provides an isolation voltage (VIORM) of up to 5000VRMS, ensuring safe operation in high-voltage environments.
  7. Temperature Considerations:

    • The operating temperature range (TOP) is from -40°C to 105°C.
    • The storage temperature range (TSTG) is from -55°C to 125°C.
  8. Handling and Storage:

    • Handle the device with care to avoid damage from electrostatic discharge (ESD).
    • Store the device in a dry, cool environment within the specified storage temperature range.
  9. Mounting and Soldering:

    • Follow recommended soldering profiles to ensure reliable connections.
    • Avoid excessive heat during soldering to prevent damage to the device.
  10. Testing:

    • Test the device under controlled conditions to verify proper operation before integrating it into a larger system.
(For reference only)

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