Description
BUY HCPL-7860P-500E https://www.utsource.net/itm/p/9517169.html
| Parameter |
Symbol |
Min |
Typ |
Max |
Unit |
| Supply Voltage |
VCC |
4.5 |
5.0 |
5.5 |
V |
| Output High Voltage |
VOH |
- |
3.8 |
- |
V (at IOL = 16 mA) |
| Output Low Voltage |
VOL |
- |
0.2 |
- |
V (at IOL = 16 mA) |
| Input Current |
IF |
10 |
20 |
50 |
mA |
| Propagation Delay Time |
tpd |
0.3 |
0.5 |
0.7 |
μs |
| Rise Time |
tr |
- |
0.1 |
- |
μs |
| Fall Time |
tf |
- |
0.1 |
- |
μs |
| Isolation Voltage |
VIORM |
- |
- |
5000 |
VRMS |
| Operating Temperature |
TOP |
-40 |
- |
105 |
°C |
| Storage Temperature |
TSTG |
-55 |
- |
125 |
°C |
Instructions for HCPL-7860P-500E
Power Supply:
- Ensure the supply voltage (VCC) is within the range of 4.5V to 5.5V.
- Connect the VCC pin to a stable power source.
Input Signal:
- Apply the input current (IF) to the input pin, ensuring it is between 10mA and 50mA.
- The input signal should be a logic level signal compatible with the specified input current range.
Output Signal:
- The output high voltage (VOH) will be approximately 3.8V when the output is high.
- The output low voltage (VOL) will be approximately 0.2V when the output is low.
- Ensure the load connected to the output can handle the specified output voltages and currents.
Propagation Delay:
- The propagation delay time (tpd) is the time it takes for the output to respond to a change in the input signal. It ranges from 0.3μs to 0.7μs.
Rise and Fall Times:
- The rise time (tr) and fall time (tf) are both typically 0.1μs, indicating fast switching times.
Isolation:
- The device provides an isolation voltage (VIORM) of up to 5000VRMS, ensuring safe operation in high-voltage environments.
Temperature Considerations:
- The operating temperature range (TOP) is from -40°C to 105°C.
- The storage temperature range (TSTG) is from -55°C to 125°C.
Handling and Storage:
- Handle the device with care to avoid damage from electrostatic discharge (ESD).
- Store the device in a dry, cool environment within the specified storage temperature range.
Mounting and Soldering:
- Follow recommended soldering profiles to ensure reliable connections.
- Avoid excessive heat during soldering to prevent damage to the device.
Testing:
- Test the device under controlled conditions to verify proper operation before integrating it into a larger system.
(For reference only)
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