LTV247 LTV-247 SOP16 L247
LTV247 LTV-247 SOP16 L247

 

LTV247 LTV-247 SOP16 L247

Utsource Holding Company Limited flag
Category: Available (Qty:9999999)
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Description

BUY LTV247 LTV-247 SOP16 L247 https://www.utsource.net/itm/p/11564743.html

Parameter Symbol Min Typ Max Unit Description
Supply Voltage VCC 4.5 - 5.5 V Operating supply voltage range
Output High Voltage VOH - 4.0 5.0 V Output high voltage at IOL = 0.4 mA
Output Low Voltage VOL 0.0 0.1 0.2 V Output low voltage at IOL = 16 mA
Input High Voltage VIH 2.0 - 5.5 V Input high voltage
Input Low Voltage VIL 0.0 - 0.8 V Input low voltage
Propagation Delay Time tpd 10 15 20 ns Propagation delay time from input to output
Power Consumption Ptot - 30 - mW Total power consumption at VCC = 5V, all outputs low
Operating Temperature Top -40 - 85 °C Operating temperature range
Storage Temperature Tstg -65 - 150 °C Storage temperature range

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the specified range of 4.5V to 5.5V.
    • Connect the ground (GND) pin to a stable ground reference.

  2. Input Signals:

    • Apply input signals with voltages between 0V and 5.5V.
    • Ensure input high voltage (VIH) is at least 2.0V and input low voltage (VIL) is no more than 0.8V for reliable operation.

  3. Output Signals:

    • The output high voltage (VOH) will be between 4.0V and 5.0V when the output is high.
    • The output low voltage (VOL) will be between 0.0V and 0.2V when the output is low.
    • Ensure the load current does not exceed the maximum ratings for output high and low states.

  4. Propagation Delay:

    • The propagation delay time (tpd) from input to output is typically 15ns, with a minimum of 10ns and a maximum of 20ns.

  5. Temperature Considerations:

    • Operate the device within the temperature range of -40°C to 85°C for optimal performance.
    • Store the device within the temperature range of -65°C to 150°C.

  6. Power Consumption:

    • The total power consumption (Ptot) should not exceed 30mW under typical operating conditions.

  7. Handling and Storage:

    • Handle the device with care to avoid static damage.
    • Store the device in a dry, cool place to prevent moisture damage.

  8. Mounting:

    • Solder the device using standard surface mount technology (SMT) procedures.
    • Ensure proper thermal management if the device is expected to operate at high temperatures or under high load conditions.
(For reference only)

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