HCPL-7840-500E A7840 HCPL7840 DIP8

HCPL-7840-500E A7840 HCPL7840 DIP8

Category: Available (Qty:9999999)
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Description

BUY HCPL-7840-500E A7840 HCPL7840 DIP8 https://www.utsource.net/itm/p/11755734.html

Parameter Symbol Min Typ Max Unit
Input Current (Forward) IF 10 20 30 mA
Input Voltage (Forward) VF 1.1 1.3 1.5 V
Output Current (Continuous) IO - 50 - mA
Output Voltage (Open Collector) VCE(sat) - 0.3 - V
Isolation Voltage VIORM - 5000 - Vrms
Propagation Delay Time tPLH, tPHL - 100 - ns
Storage Temperature Tstg -40 - 125 °C
Operating Temperature Topr -40 - 85 °C

Instructions for HCPL-7840-500E A7840 HCPL7840 DIP8:

  1. Power Supply:

    • Ensure the input and output power supplies are within the specified voltage ranges.
    • Use a stable power supply to avoid fluctuations that could affect performance.
  2. Input Signal:

    • Apply the input signal with a forward current (IF) between 10 mA and 30 mA.
    • The forward voltage (VF) should be between 1.1 V and 1.5 V.
  3. Output Configuration:

    • Connect the output to a load that can handle up to 50 mA of continuous current.
    • Ensure the output voltage (VCE(sat)) is no more than 0.3 V when the output is active.
  4. Isolation:

    • The device provides an isolation voltage (VIORM) of up to 5000 Vrms. Ensure that the input and output circuits are properly isolated to prevent electrical hazards.
  5. Timing:

    • The propagation delay time (tPLH, tPHL) is typically 100 ns. Design your circuit to account for this delay to ensure proper operation.
  6. Temperature Considerations:

    • Store the device in an environment with temperatures ranging from -40°C to 125°C.
    • Operate the device within the temperature range of -40°C to 85°C to ensure reliable performance.
  7. Handling:

    • Handle the device with care to avoid static discharge, which can damage the internal components.
    • Follow proper soldering techniques to ensure good electrical connections and to prevent thermal damage.
  8. Mounting:

    • Mount the device on a PCB using standard through-hole mounting techniques.
    • Ensure that the pins are securely soldered and aligned correctly to avoid mechanical stress.
  9. Testing:

    • Test the device after installation to verify that it meets the specified parameters and operates correctly in your application.
  10. Compliance:

    • Ensure that your design complies with relevant safety and regulatory standards, especially if the device is used in safety-critical applications.
(For reference only)

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