Description
BUY SN65C1168ENSR 65C1168E SN65C1168NSR https://www.utsource.net/itm/p/9477402.html
| Parameter |
Symbol |
Min |
Typical |
Max |
Unit |
Notes |
| Supply Voltage |
Vcc |
4.75 |
5.0 |
5.25 |
V |
|
| Operating Temperature Range |
|
-40 |
|
85 |
°C |
|
| Storage Temperature Range |
|
-65 |
|
150 |
°C |
|
| Output High Voltage |
VOH |
3.7 |
4.9 |
5.0 |
V |
@ IOL = -4mA, VCC = 5V |
| Output Low Voltage |
VOL |
0.0 |
0.1 |
0.4 |
V |
@ IOH = 4mA, VCC = 5V |
| Input High Voltage |
VIH |
3.5 |
|
5.0 |
V |
|
| Input Low Voltage |
VIL |
0.0 |
|
1.5 |
V |
|
| Input Leakage Current |
IIL |
-1 |
0 |
1 |
μA |
|
| Output Leakage Current |
IOL |
-1 |
0 |
1 |
μA |
|
| Propagation Delay Time (Low to High) |
tPLH |
10 |
15 |
25 |
ns |
@ VCC = 5V, TA = 25°C |
| Propagation Delay Time (High to Low) |
tPHL |
10 |
15 |
25 |
ns |
@ VCC = 5V, TA = 25°C |
| Skew |
tSK |
0 |
2 |
5 |
ns |
@ VCC = 5V, TA = 25°C |
| Power Dissipation |
PD |
|
250 |
|
mW |
@ VCC = 5V, TA = 25°C |
Instructions for Use:
Power Supply:
- Ensure the supply voltage (Vcc) is within the specified range of 4.75V to 5.25V.
- Use a stable power source to avoid fluctuations that could affect performance.
Temperature Considerations:
- The device operates within an ambient temperature range of -40°C to 85°C.
- Store the device in temperatures ranging from -65°C to 150°C.
Input and Output Levels:
- Ensure input voltages (VIH and VIL) are within the specified ranges to prevent damage or incorrect operation.
- Check output voltages (VOH and VOL) to ensure they meet the required levels for your application.
Current Limits:
- Monitor input and output currents (IIL, IOL) to stay within the specified limits to avoid overheating or damage.
Timing Parameters:
- Verify propagation delay times (tPLH, tPHL) and skew (tSK) to ensure proper timing in your circuit design.
Power Dissipation:
- Ensure the power dissipation (PD) does not exceed the maximum rating to avoid thermal issues.
Handling and Storage:
- Handle the device with care to avoid static damage.
- Store in a dry, cool place to prevent moisture-related issues.
Mounting and Soldering:
- Follow recommended soldering profiles to avoid thermal stress during assembly.
- Ensure proper mechanical support and alignment during mounting.
Testing:
- Test the device under typical operating conditions to verify its functionality.
- Use appropriate test equipment and procedures to avoid damaging the device.
Documentation:
- Refer to the datasheet and application notes for detailed information and specific use cases.
(For reference only)
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