CD4002AE

CD4002AE

Category: Available (Qty:9999999)
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Description

BUY CD4002AE https://www.utsource.net/itm/p/1400627.html
Logic IC

Parameter Symbol Conditions Min Typical Max Unit
Supply Voltage VDD Operating 3.0 - 18.0 V
Input Voltage (High) VIH - 70% VDD - - V
Input Voltage (Low) VIL - - - 30% VDD V
Output Voltage (High) VOH IO = -1.0 mA 90% VDD - - V
Output Voltage (Low) VOL IO = 1.0 mA - - 1.0 V
Input Current (High) IIH VI = VDD -1.0 - - μA
Input Current (Low) IIL VI = 0 V - - 1.0 μA
Output Current (High) IOH VO = VDD - 1.5 V - - -1.0 mA
Output Current (Low) IOL VO = 0.5 V - - 1.0 mA
Propagation Delay Time tpd VDD = 5 V, fo = 1 MHz 35 - - ns
Power Dissipation PD Maximum - - 500 mW

Instructions for Using CD4002AE:

  1. Supply Voltage:

    • Ensure the supply voltage is within the range of 3.0 V to 18.0 V.
    • Avoid exceeding the maximum supply voltage to prevent damage to the device.
  2. Input Voltage Levels:

    • For a high input level, ensure the voltage is at least 70% of VDD.
    • For a low input level, ensure the voltage is no more than 30% of VDD.
  3. Output Voltage Levels:

    • When sourcing current (output high), the output voltage should be at least 90% of VDD.
    • When sinking current (output low), the output voltage should not exceed 1.0 V.
  4. Current Ratings:

    • The input current should not exceed 1.0 μA for a low input and should not be less than -1.0 μA for a high input.
    • The output current should not exceed 1.0 mA when sinking and should not be less than -1.0 mA when sourcing.
  5. Propagation Delay:

    • The propagation delay time is typically 35 ns at a supply voltage of 5 V and a frequency of 1 MHz.
  6. Power Dissipation:

    • The maximum power dissipation is 500 mW. Ensure adequate heat dissipation if operating near this limit.
  7. Handling Precautions:

    • Handle the device with care to avoid static discharge which can damage the sensitive components.
    • Use appropriate ESD protection measures during handling and installation.
  8. Storage:

    • Store the device in a dry, cool place to prevent moisture damage.
  9. Soldering:

    • Follow recommended soldering profiles to avoid thermal damage to the device.
  10. Testing:

    • Use a multimeter or an oscilloscope to verify the correct operation of the device after installation.
(For reference only)

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