CD4073BM
CD4073BM

 

CD4073BM

Utsource Holding Company Limited flag
Category: Available (Qty:9999999)
For more information, visit our official website at utsource.us
Visit Official Site Contact Us
Description

BUY CD4073BM https://www.utsource.net/itm/p/4326687.html
CMOS AND GATES

Parameter Symbol Min Typ Max Unit Description
Supply Voltage VCC 3 - 18 V Operating supply voltage range
Input High Level Voltage VIH 2 - VCC - 1.5 V Minimum input voltage to be recognized as high
Input Low Level Voltage VIL 0 - 1.5 V Maximum input voltage to be recognized as low
Output High Level Voltage VOH - - VCC - 0.5 V Minimum output voltage when high
Output Low Level Voltage VOL 0 - 0.5 V Maximum output voltage when low
Propagation Delay Time tpd - 15 50 ns Time delay from input change to output change
Power Dissipation PTOT - - 100 mW Maximum power dissipation at 25°C ambient temperature
Operating Temperature Range TA -40 - 85 °C Ambient operating temperature range
Storage Temperature Range TSTG -65 - 150 °C Temperature range for storage

Instructions for Use:

  1. Supply Voltage:

    • Ensure the supply voltage (VCC) is within the specified range of 3V to 18V.
    • Connect VCC to the positive supply and GND to the ground.

  2. Input Levels:

    • Inputs should be kept within the valid voltage ranges for high (VIH) and low (VIL) levels.
    • Avoid floating inputs; use pull-up or pull-down resistors if necessary.

  3. Output Levels:

    • The output high level (VOH) will be close to VCC minus a small voltage drop.
    • The output low level (VOL) will be close to 0V.

  4. Propagation Delay:

    • Account for the propagation delay time (tpd) when designing circuits to ensure proper timing.

  5. Power Dissipation:

    • Do not exceed the maximum power dissipation (PTOT) to avoid overheating and potential damage.

  6. Temperature Considerations:

    • Operate the device within the specified ambient temperature range (TA).
    • Store the device within the specified storage temperature range (TSTG).

  7. Handling:

    • Handle the device with care to avoid static discharge, which can damage sensitive components.
    • Follow standard ESD (Electrostatic Discharge) precautions.

  8. Mounting:

    • Solder the device using recommended temperatures and times to avoid thermal stress.
    • Ensure proper mechanical support and alignment during PCB assembly.
(For reference only)

More detail about Utsource Holding Company Limited
Utsource Holding Company Limited
Utsource Holding Company Limited Electronic Component Wholesaler, IC Chip Distributor, IGBT Module Supplier in California, USA | Utsource Holding Company Limited
Contact Us flag