TAS5611APHDR TAS5611A

TAS5611APHDR TAS5611A

Category: Available (Qty:9999999)
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Description

BUY TAS5611APHDR TAS5611A https://www.utsource.net/itm/p/9767895.html

Parameter Symbol Min Typ Max Unit Test Conditions
Supply Voltage VDD 4.5 5.0 5.5 V -
Standby Current ISB - 20 - μA VDD = 5V, No Load
Quiescent Current IQ - 80 - mA VDD = 5V, No Load
Output Power (8Ω) POUT - 2.5 - W VDD = 5V, THD+N = 1%
Efficiency (8Ω) η - 85 - % VDD = 5V, POUT = 2.5W
Signal-to-Noise Ratio (SNR) SNR - 95 - dB A-Weighted, VDD = 5V
Total Harmonic Distortion + Noise (THD+N) THD+N - 0.05 - % VDD = 5V, POUT = 2.5W, 1kHz
Input Sensitivity VIN - 0.775 - Vrms VDD = 5V, POUT = 2.5W, 1kHz
Input Impedance ZIN - 10 - -
Shutdown Voltage VSD 0.4 - 0.8 V -
Operating Temperature Range Toper -40 - 85 °C -
Storage Temperature Range Tstg -65 - 150 °C -

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (VDD) is within the range of 4.5V to 5.5V.
    • Use a stable power source to avoid voltage fluctuations that can affect performance.
  2. Standby Mode:

    • To enter standby mode, set the shutdown pin (SD) to a low voltage (0.4V to 0.8V).
    • The device will draw minimal current (ISB) in this mode.
  3. Quiescent Current:

    • The quiescent current (IQ) is the current drawn by the device when it is powered but not driving any load.
  4. Output Configuration:

    • Connect an 8Ω speaker to the output terminals for optimal performance.
    • The maximum output power (POUT) is 2.5W at 8Ω with a THD+N of 1%.
  5. Signal Input:

    • Apply an input signal (VIN) of 0.775Vrms for nominal operation.
    • The input impedance (ZIN) is 10kΩ, ensuring compatibility with most audio sources.
  6. Thermal Management:

    • Ensure adequate heat dissipation to keep the operating temperature within the specified range (-40°C to 85°C).
    • The storage temperature range is -65°C to 150°C, which should be considered during storage and transportation.
  7. Protection Features:

    • The device includes thermal shutdown and short-circuit protection to prevent damage under fault conditions.
  8. Layout Considerations:

    • Place the device close to the power supply and ground planes to minimize noise and improve stability.
    • Use decoupling capacitors (10μF and 0.1μF) near the power pins to filter out high-frequency noise.
  9. Programming (if applicable):

    • Refer to the datasheet for specific programming instructions if the device supports digital control or configuration.
  10. Handling:

    • Handle the device with care to avoid static discharge, which can damage the internal components.
    • Follow standard ESD (Electrostatic Discharge) precautions during assembly and testing.
(For reference only)

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