Description
BUY ICL7611DCPA https://www.utsource.net/itm/p/12379376.html
| Parameter |
Symbol |
Conditions |
Min |
Typ |
Max |
Unit |
| Supply Voltage |
VCC |
- |
2.0 |
5.0 |
18.0 |
V |
| Operating Temperature |
TA |
- |
-40 |
- |
85 |
°C |
| Storage Temperature |
TSTG |
- |
-65 |
- |
150 |
°C |
| Input Voltage Range |
VI |
- |
0 |
- |
VCC |
V |
| Output Current (Sink) |
IOL |
VO = 0.4V |
10 |
20 |
30 |
mA |
| Output Current (Source) |
IOH |
VO = VCC - 0.4V |
10 |
20 |
30 |
mA |
| Quiescent Current |
IQ |
- |
0.1 |
0.5 |
1.0 |
μA |
| Propagation Delay Time |
td |
VCC = 5V, VI = 2.5V, VO = 2.5V |
100 |
200 |
300 |
ns |
| Power Dissipation |
PD |
- |
- |
- |
180 |
mW |
Instructions for Use:
Supply Voltage:
- Ensure the supply voltage is within the range of 2.0V to 18.0V.
- Avoid exceeding the maximum supply voltage to prevent damage to the device.
Temperature Considerations:
- The operating temperature range is from -40°C to 85°C.
- Store the device in an environment where the temperature does not exceed -65°C to 150°C.
Input Voltage:
- The input voltage should be between 0V and the supply voltage (VCC).
Output Current:
- The device can sink or source up to 30mA of current.
- Ensure that the load connected to the output does not exceed these limits to avoid damage.
Quiescent Current:
- The quiescent current is very low, typically ranging from 0.1μA to 1.0μA.
- This makes the device suitable for battery-operated applications.
Propagation Delay:
- The propagation delay time is the time it takes for the output to respond to a change in the input.
- At a supply voltage of 5V, the typical delay is around 200ns.
Power Dissipation:
- The maximum power dissipation is 180mW.
- Ensure adequate heat dissipation if the device is expected to operate near this limit.
Handling:
- Handle the device with care to avoid static discharge, which can damage sensitive components.
- Use appropriate ESD protection measures during handling and installation.
Mounting:
- Follow standard surface mount technology (SMT) procedures for mounting the device on a PCB.
- Ensure proper soldering to avoid cold solder joints and ensure reliable operation.
Testing:
- Before final assembly, test the device to ensure it meets the specified parameters.
- Use a multimeter to check for short circuits and open circuits.
(For reference only)
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