ICL7611DCPA

ICL7611DCPA

Category: Elec-component Available (Qty:9999999)
For more information, visit our official website at utsource.us

Description

BUY ICL7611DCPA https://www.utsource.net/itm/p/12379376.html

Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage VCC - 2.0 5.0 18.0 V
Operating Temperature TA - -40 - 85 °C
Storage Temperature TSTG - -65 - 150 °C
Input Voltage Range VI - 0 - VCC V
Output Current (Sink) IOL VO = 0.4V 10 20 30 mA
Output Current (Source) IOH VO = VCC - 0.4V 10 20 30 mA
Quiescent Current IQ - 0.1 0.5 1.0 μA
Propagation Delay Time td VCC = 5V, VI = 2.5V, VO = 2.5V 100 200 300 ns
Power Dissipation PD - - - 180 mW

Instructions for Use:

  1. Supply Voltage:

    • Ensure the supply voltage is within the range of 2.0V to 18.0V.
    • Avoid exceeding the maximum supply voltage to prevent damage to the device.
  2. Temperature Considerations:

    • The operating temperature range is from -40°C to 85°C.
    • Store the device in an environment where the temperature does not exceed -65°C to 150°C.
  3. Input Voltage:

    • The input voltage should be between 0V and the supply voltage (VCC).
  4. Output Current:

    • The device can sink or source up to 30mA of current.
    • Ensure that the load connected to the output does not exceed these limits to avoid damage.
  5. Quiescent Current:

    • The quiescent current is very low, typically ranging from 0.1μA to 1.0μA.
    • This makes the device suitable for battery-operated applications.
  6. Propagation Delay:

    • The propagation delay time is the time it takes for the output to respond to a change in the input.
    • At a supply voltage of 5V, the typical delay is around 200ns.
  7. Power Dissipation:

    • The maximum power dissipation is 180mW.
    • Ensure adequate heat dissipation if the device is expected to operate near this limit.
  8. Handling:

    • Handle the device with care to avoid static discharge, which can damage sensitive components.
    • Use appropriate ESD protection measures during handling and installation.
  9. Mounting:

    • Follow standard surface mount technology (SMT) procedures for mounting the device on a PCB.
    • Ensure proper soldering to avoid cold solder joints and ensure reliable operation.
  10. Testing:

    • Before final assembly, test the device to ensure it meets the specified parameters.
    • Use a multimeter to check for short circuits and open circuits.
(For reference only)

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