9LRS3165BGLFT

9LRS3165BGLFT

Category: Application Specific Available (Qty:9999999)
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Description

BUY 9LRS3165BGLFT https://www.utsource.net/itm/p/12402858.html

Parameter Value Unit
Part Number 9LRS3165BGLFT
Package Type BGA
Pin Count 256
Operating Temperature -40 to 125 °C
Supply Voltage (Vcc) 1.8 to 3.6 V
I/O Voltage (Vio) 1.2 to 3.6 V
Maximum Clock Frequency 200 MHz
Data Width 16-bit
Memory Size 16 Mb
Access Time 15 ns
Standby Current 10 μA
Active Current 50 mA
Write Cycle Time 50 ns
Package Material Lead-Free
RoHS Compliant Yes

Instructions for Use

  1. Power Supply:

    • Ensure that the supply voltage (Vcc) is within the range of 1.8V to 3.6V.
    • The I/O voltage (Vio) should be set between 1.2V and 3.6V.
  2. Temperature Range:

    • Operate the device within the temperature range of -40°C to 125°C to ensure reliable performance.
  3. Clock Frequency:

    • The maximum clock frequency is 200 MHz. Ensure that the clock signal is stable and within this limit.
  4. Data Handling:

    • The device supports a 16-bit data width. Configure the data lines accordingly.
  5. Memory Operations:

    • The memory size is 16 Mb. Use the appropriate commands to read from and write to the memory.
    • The access time is 15 ns, and the write cycle time is 50 ns. Ensure that your system timing meets these requirements.
  6. Current Consumption:

    • In standby mode, the current consumption is 10 μA.
    • In active mode, the current consumption can reach up to 50 mA.
  7. Package Handling:

    • The device uses a BGA package with 256 pins. Handle the package carefully to avoid damage to the solder balls.
    • The package is lead-free and RoHS compliant.
  8. Soldering and Mounting:

    • Follow standard BGA soldering guidelines to ensure proper mounting on the PCB.
    • Use a reflow soldering process with appropriate temperature profiles to avoid thermal stress.
  9. Testing and Verification:

    • After mounting, perform functional tests to verify the correct operation of the device.
    • Check for any shorts or open circuits in the power and ground connections.
  10. Storage:

    • Store the device in a dry, cool environment to prevent moisture damage.
    • Use anti-static packaging to protect the device from electrostatic discharge (ESD).
(For reference only)

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