SN74LS45N: Top Choice in United States (USA) Utsource Holding Company Limited

Description

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	V_CC	Operating	4.75	5	5.25	V
Input Low Voltage	V_IL	Input	0	0.8	-	V
Input High Voltage	V_IH	Input	2	3.5	-	V
Output Low Voltage	V_OL	I_OL = 16 mA	0	0.4	-	V
Output High Voltage	V_OH	I_OH = -0.4 mA	2.4	3.4	-	V
Input Current (Low)	I_IL	V_IL = 0.8 V	-0.4	-0.1	-	mA
Input Current (High)	I_IH	V_IH = 2.0 V	16	40	-	μA
Output Current (Low)	I_OL	V_OL = 0.4 V	8	16	-	mA
Output Current (High)	I_OH	V_OH = 2.4 V	-0.4	-0.8	-	mA
Propagation Delay Time	t_p	Typical	-	15	22	ns
Power Dissipation	P_D	Maximum	-	-	100	mW
Operating Temperature Range	T_A	Commercial	0	-	70	°C
Storage Temperature Range	T_STG		-65	-	150	°C

Power Supply:
- Ensure the supply voltage (V_CC) is within the specified range of 4.75 V to 5.25 V.
- Connect the ground (GND) pin to a stable 0 V reference.
Input Signals:
- Apply input signals that meet the input voltage levels: V_IL ≤ 0.8 V for logic low and V_IH ≥ 2.0 V for logic high.
- Ensure input currents do not exceed the specified limits to avoid damage to the device.
Output Signals:
- The output voltages should be within the specified ranges: V_OL ≤ 0.4 V for logic low and V_OH ≥ 2.4 V for logic high.
- Do not exceed the maximum output current ratings to prevent overheating or damage.
Propagation Delay:
- Consider the propagation delay time (t_p) when designing circuits to ensure proper timing and synchronization.
Temperature:
- Operate the device within the specified temperature range to ensure reliable performance.
- Store the device within the storage temperature range to prevent damage during non-operational periods.
Handling:
- Handle the device with care to avoid static discharge, which can damage sensitive components.
- Follow standard ESD (Electrostatic Discharge) precautions when handling and installing the device.
Mounting:
- Ensure proper mounting and soldering techniques to maintain good electrical connections and thermal dissipation.
- Avoid excessive mechanical stress on the pins and package.

(For reference only)