SN74LS258AN

SN74LS258AN

Category: Elec-component Available (Qty:9999999)
For more information, visit our official website at utsource.us

Description

BUY SN74LS258AN https://www.utsource.net/itm/p/59259.html
2-Input Digital Multiplexer

Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage VCC Operating 4.75 5.0 5.25 V
Input High Voltage VIH IIH = 20 渭A 2.0 - VCC V
Input Low Voltage VIL IIL = -0.4 mA 0 - 0.8 V
Output High Voltage VOH IOH = -0.4 mA 2.4 - VCC - 0.5 V
Output Low Voltage VOL IOL = 16 mA 0 - 0.5 V
Propagation Delay Time tpd VCC = 5V, TA = 25掳C - 35 60 ns
Power Dissipation PD Per Package - - 500 mW
Operating Temperature TA Commercial Grade 0 - 70 掳C
Storage Temperature TSTG -65 - 150 掳C

Instructions for Use

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the specified range (4.75V to 5.25V) to avoid damage to the device.
  2. Input Levels:

    • For a logic high input, the voltage should be between 2.0V and VCC.
    • For a logic low input, the voltage should be between 0V and 0.8V.
  3. Output Levels:

    • The output high voltage (VOH) should be at least 2.4V when sourcing up to 0.4 mA.
    • The output low voltage (VOL) should be no more than 0.5V when sinking up to 16 mA.
  4. Propagation Delay:

    • The propagation delay time (tpd) is typically 35 ns but can vary between 35 ns and 60 ns under standard operating conditions.
  5. Power Dissipation:

    • The maximum power dissipation per package is 500 mW. Ensure proper heat dissipation if operating near this limit.
  6. Temperature Range:

    • The device is rated for operation from 0掳C to 70掳C for commercial grade applications.
    • Store the device in a temperature range from -65掳C to 150掳C.
  7. Handling:

    • Handle with care to avoid static discharge which can damage the device.
    • Follow standard ESD (Electrostatic Discharge) precautions during handling and installation.
  8. Mounting:

    • Ensure proper mounting on a PCB to maintain thermal and electrical performance.
    • Use appropriate soldering techniques and avoid excessive heat during soldering.
  9. Testing:

    • Before integrating into a larger system, test the device under typical operating conditions to ensure it meets the required specifications.
(For reference only)

More detail about Utsource Holding Company Limited
Utsource Holding Company Limited
Utsource Holding Company Limited Electronic Component Wholesaler, IC Chip Distributor, IGBT Module Supplier in California, USA | Utsource Holding Company Limited