74HC174AP

74HC174AP

Category: Elec-component Available (Qty:9999999)
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Description

BUY 74HC174AP https://www.utsource.net/itm/p/71141.html
HEX D TYPE FLIP FLOP WITH CLEAR

Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage VCC Operating 2.0 - 6.0 V
Input Low Voltage VIL VCC = 5V 0.8 - - V
Input High Voltage VIH VCC = 5V - - 2.0 V
Output Low Voltage VOL IOL = 4mA, VCC = 5V 0.1 - 0.2 V
Output High Voltage VOH IOH = -0.4mA, VCC = 5V 4.5 - 5.0 V
Input Leakage Current IIL VCC = 5V -1.0 - 1.0 渭A
Output Leakage Current IOL VCC = 5V -100 - 100 渭A
Propagation Delay Time tpd VCC = 5V, VI = 2.5V, CL = 50pF - 13 - ns
Power Consumption Ptot VCC = 5V, f = 1MHz, TA = 25掳C - 1.5 - mW
Operating Temperature Range TA Commercial 0 - 70 掳C
Storage Temperature Range TSTG -65 - 150 掳C

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the range of 2.0V to 6.0V.
    • Connect the ground (GND) pin to a stable 0V reference.
  2. Input Signals:

    • Input signals should be within the specified input voltage levels (VIL and VIH).
    • Avoid applying voltages outside the VCC range to the inputs to prevent damage.
  3. Output Signals:

    • The output voltage levels (VOL and VOH) are defined for typical operating conditions.
    • Ensure the load connected to the output does not exceed the maximum current ratings.
  4. Propagation Delay:

    • The propagation delay time (tpd) is critical for timing considerations in digital circuits.
    • Use the typical value for general design purposes, but consider the worst-case scenario for critical applications.
  5. Temperature Considerations:

    • The device is designed to operate within the commercial temperature range (0掳C to 70掳C).
    • Store the device within the storage temperature range (-65掳C to 150掳C) to avoid degradation.
  6. Handling:

    • Handle the device with care to avoid static discharge, which can damage the internal circuits.
    • Use proper anti-static precautions when handling and soldering the device.
  7. Decoupling Capacitors:

    • Place decoupling capacitors (typically 0.1渭F) close to the power pins to filter out noise and ensure stable operation.
  8. Layout:

    • Follow good PCB layout practices, including short traces and proper grounding, to minimize signal interference and improve performance.
  9. Testing:

    • Test the device under typical operating conditions to verify its functionality before integrating it into a larger system.
(For reference only)

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