74 series Digital Integrated Circuits
TC74HC139AF
TC74HC139AF

 

TC74HC139AF

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Category: 74 series Digital Integrated Circuits Available (Qty:9999999)
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Description

BUY TC74HC139AF https://www.utsource.net/itm/p/1567617.html
Single 60 V Inductive Load Driver; Package: SOT-23 TO-236 3 LEAD; No of Pins: 3; Container: Tape and Reel; Qty per Container: 3000

Parameter Symbol Conditions Min Typical Max Unit
Supply Voltage VCC - 2.0 - 6.0 V
Input Low Voltage VIL IL = 1.0 mA 0.3 - 1.5 V
Input High Voltage VIH IH = -0.4 mA 2.0 - VCC - 0.8 V
Output Low Voltage VOL IOL = 8 mA 0.1 - 0.4 V
Output High Voltage VOH IOH = -0.4 mA VCC - 0.1 - VCC - 0.4 V
Propagation Delay Time tpd VCC = 4.5 V, TA = 25°C - 11 - ns
Power Dissipation PD Continuous - - 100 mW
Operating Temperature Range TA - -40 - 85 °C
Storage Temperature Range TSTG - -65 - 150 °C

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the range of 2.0 V to 6.0 V.
    • Connect the ground (GND) pin to a stable reference ground.

  2. Input Signals:

    • Input signals should be within the specified input voltage levels (VIL and VIH).
    • Avoid applying voltages outside the supply voltage range to the inputs.

  3. Output Signals:

    • The output low voltage (VOL) and output high voltage (VOH) should be within the specified limits.
    • Ensure that the load connected to the outputs does not exceed the maximum current ratings.

  4. Propagation Delay:

    • The propagation delay time (tpd) is typically 11 ns at VCC = 4.5 V and TA = 25°C. Adjust your timing calculations accordingly.

  5. Temperature Considerations:

    • Operate the device within the specified operating temperature range (-40°C to 85°C).
    • Store the device within the storage temperature range (-65°C to 150°C).

  6. Power Dissipation:

    • Ensure that the power dissipation (PD) does not exceed 100 mW to avoid overheating and potential damage.

  7. Handling:

    • Handle the device with care to avoid static discharge, which can damage the internal circuits.
    • Follow proper ESD (Electrostatic Discharge) precautions during handling and installation.

  8. Mounting:

    • Ensure proper mounting on the PCB to maintain good thermal and electrical connections.
    • Use appropriate soldering techniques and avoid excessive heat during soldering.
(For reference only)

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