74HC20AP

Category: 74 series Digital Integrated Circuits Available (Qty:9999999)
For more information, visit our official website at utsource.us

Description

BUY 74HC20AP https://www.utsource.net/itm/p/1576421.html
74HC/HCT20; Dual 4-input NAND gate

Parameter Symbol Min Typical Max Unit
Supply Voltage VCC 2.0 - 6.0 V
Input Low Voltage VIL - 0.8 - V
Input High Voltage VIH - 2.0 - V
Output Low Voltage VOL - 0.1 0.4 V
Output High Voltage VOH 2.4 - 5.0 V
Input Current (Low) IIL -1.0 - -0.4 mA
Input Current (High) I<subIH - 0.4 1.0 μA
Output Current (Low) IOL - -25 - mA
Output Current (High) IOH - 25 - mA
Propagation Delay Time tpd - 9 22 ns
Power Dissipation PD - - 100 mW

Instructions for 74HC20AP:

  1. Supply Voltage (VCC):

    • Ensure the supply voltage is within the range of 2.0V to 6.0V.
    • Avoid connecting the supply voltage outside this range to prevent damage to the device.
  2. Input Voltages (VIL, VIH):

    • For a valid low input, the voltage should be less than or equal to 0.8V.
    • For a valid high input, the voltage should be greater than or equal to 2.0V.
    • Inputs should not exceed the supply voltage (VCC) or go below ground (0V).
  3. Output Voltages (VOL, VOH):

    • The output will be considered low if it is between 0.1V and 0.4V.
    • The output will be considered high if it is between 2.4V and 5.0V.
    • Ensure the load connected to the output does not exceed the maximum output current ratings.
  4. Current Ratings (IIL, IIH, IOL, IOH):

    • Input current when low should not exceed -0.4mA.
    • Input current when high should not exceed 1.0μA.
    • Output current when low should not exceed -25mA.
    • Output current when high should not exceed 25mA.
  5. Propagation Delay (tpd):

    • The propagation delay time is the time it takes for the output to change state after the input changes.
    • Typical propagation delay is 9ns, with a maximum of 22ns.
  6. Power Dissipation (PD):

    • The maximum power dissipation is 100mW.
    • Ensure proper heat dissipation if the device is expected to operate near its maximum power dissipation.
  7. Handling and Storage:

    • Handle the device with care to avoid static damage.
    • Store in a dry environment to prevent moisture damage.
  8. Mounting and Soldering:

    • Follow standard surface mount technology (SMT) guidelines for mounting and soldering.
    • Use appropriate soldering temperatures and profiles to avoid thermal damage.
(For reference only)

More detail about Utsource Holding Company Limited
Utsource Holding Company Limited
Utsource Holding Company Limited Electronic Component Wholesaler, IC Chip Distributor, IGBT Module Supplier in California, USA | Utsource Holding Company Limited