74 series Digital Integrated Circuits
74HCT688AP
74HCT688AP

 

74HCT688AP

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Category: 74 series Digital Integrated Circuits Available (Qty:9999999)
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Description

BUY 74HCT688AP https://www.utsource.net/itm/p/1766070.html
Dual 4-Input Positive-NAND Gates 14-SOIC -40 to 85

Parameter Symbol Min Typ Max Unit Description
Supply Voltage VCC 2.0 - 6.0 V Operating supply voltage
Input Low Voltage VIL - - 1.5 V Maximum input low voltage
Input High Voltage VIH 3.5 - - V Minimum input high voltage
Output Low Voltage (IOL=20mA) VOL - 0.4 0.5 V Maximum output low voltage
Output High Voltage (IOH=-20mA) VOH 4.5 - - V Minimum output high voltage
Input Leakage Current IIL - -1 1 μA Maximum input leakage current
Output Leakage Current (VOL) IOL - -1 1 μA Maximum output leakage current (low state)
Output Leakage Current (VOH) IOH - 1 -1 μA Maximum output leakage current (high state)
Propagation Delay Time (typical) tpd - 9 - ns Typical propagation delay time
Power Dissipation PD - - 200 mW Maximum power dissipation per package
Operating Temperature Range TA -40 - 85 °C Ambient operating temperature range
Storage Temperature Range TSTG -65 - 150 °C Storage temperature range

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the specified range of 2.0V to 6.0V.
    • Connect the ground (GND) pin to a stable reference point.

  2. Input Signals:

    • Apply input signals such that the low level (VIL) does not exceed 1.5V and the high level (VIH) is at least 3.5V.
    • Be aware of the input leakage current (IIL), which can affect the stability of the input signal.

  3. Output Signals:

    • The output low voltage (VOL) should not exceed 0.5V when sourcing 20mA.
    • The output high voltage (VOH) should be at least 4.5V when sinking -20mA.
    • Consider the output leakage currents (IOL and IOH) when designing the load circuit.

  4. Propagation Delay:

    • The typical propagation delay time (tpd) is 9ns, which affects the speed of signal transmission through the device.

  5. Thermal Management:

    • Ensure the device operates within the ambient temperature range of -40°C to 85°C.
    • Store the device within the storage temperature range of -65°C to 150°C to avoid damage.

  6. Power Dissipation:

    • The maximum power dissipation (PD) is 200mW. Design the circuit to ensure this limit is not exceeded to prevent overheating and potential failure.

  7. Handling and Storage:

    • Handle the device with care to avoid static damage.
    • Store the device in a dry, cool place within the specified storage temperature range.

  8. Schematic and Layout:

    • Follow recommended PCB layout guidelines to minimize noise and ensure reliable operation.
    • Use decoupling capacitors near the power supply pins to filter out noise and stabilize the supply voltage.
(For reference only)

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