74HCT574AP: Top Choice in United States (USA) Utsource Holding Company Limited

Description

Parameter	Symbol	Min	Typ	Max	Unit	Notes
Supply Voltage	V_CC	2.0	-	6.0	V
Input High Voltage	V_IH	2.0	-	V_CC	V
Input Low Voltage	V_IL	0	-	0.8	V
Output High Voltage	V_OH	2.4	-	V_CC - 0.1	V
Output Low Voltage	V_OL	0	-	0.4	V
Propagation Delay Time	t_pd	-	10	30	ns	@ V_CC = 5V, TA = 25°C
Latch Enable Low to High	t_LELH	-	10	30	ns	@ V_CC = 5V, TA = 25°C
Latch Enable High to Low	t_LEHL	-	10	30	ns	@ V_CC = 5V, TA = 25°C
Power Dissipation	P_D	-	-	100	mW	Per Package
Operating Temperature	T_A	-40	-	85	°C
Storage Temperature	T_STG	-65	-	150	°C

Power Supply:
- Ensure the supply voltage (V_CC) is within the range of 2.0V to 6.0V.
- Connect the ground (GND) pin to a stable ground reference.
Input Signals:
- Apply input signals (D0-D7) that meet the specified input high (V_IH) and input low (V_IL) voltage levels.
- The latch enable (LE) signal controls when the data is latched into the register. A high-to-low transition on LE will latch the data.
Output Signals:
- The output signals (Q0-Q7) will reflect the latched data.
- Ensure the load connected to the outputs does not exceed the maximum current ratings.
Propagation Delay:
- Account for the propagation delay time (t_pd) when designing your circuit to ensure proper timing.
Temperature Considerations:
- Operate the device within the specified temperature range (T_A) to avoid damage or performance degradation.
- Store the device in an environment within the storage temperature range (T_STG).
Power Dissipation:
- Ensure the total power dissipation (P_D) does not exceed the maximum rating to prevent overheating.
Handling:
- Handle the device with care to avoid static damage. Use appropriate ESD protection measures.
Mounting:
- Mount the device on a PCB with proper thermal management if operating at high temperatures or high power dissipation.

(For reference only)