EP2C5Q208C8N EP2C5Q208C8 QFP208

EP2C5Q208C8N EP2C5Q208C8 QFP208

Category: 74 series Digital Integrated Circuits Available (Qty:9999999)
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Description

BUY EP2C5Q208C8N EP2C5Q208C8 QFP208 https://www.utsource.net/itm/p/9477124.html

Parameter Description Value
Device Device Name EP2C5Q208C8N
Package Package Type QFP208
Pin Count Number of Pins 208
Operating Temperature Operating Temperature Range -40°C to +85°C
Supply Voltage (VCC) Core Supply Voltage 1.2V
I/O Voltage (VCCIO) I/O Supply Voltage 1.5V, 1.8V, 2.5V, 3.3V
Configuration Voltage (VCCCONF) Configuration Supply Voltage 1.8V, 2.5V, 3.3V
Configuration Mode Configuration Modes Active Serial, Passive Serial, JTAG, AS+PS, AS+JTAG, PS+JTAG
Clock Frequency Maximum Clock Frequency 275 MHz
Logic Cells Number of Logic Cells 5,000
RAM Blocks Number of RAM Blocks 56
Multiplier Blocks Number of Multiplier Blocks 8
I/O Banks Number of I/O Banks 14
I/O Standards Supported I/O Standards LVCMOS15, LVCMOS18, LVCMOS25, LVCMOS33, SSTL-2, SSTL-3, HSTL, PCI, PCIX, LVDS, RSDS
Configuration Memory Configuration Memory Size 1.5 Mb
Package Pitch Pin Pitch 0.5 mm
Package Dimensions Body Dimensions 20 mm x 20 mm
Thermal Resistance (θJA) Junction-to-Ambient Thermal Resistance 29.5°C/W

Instructions for Use:

  1. Power Supply Connections:

    • Connect VCC (1.2V) to the core power supply.
    • Connect VCCIO to the appropriate I/O voltage level (1.5V, 1.8V, 2.5V, or 3.3V).
    • Connect VCCCONF to the configuration supply voltage (1.8V, 2.5V, or 3.3V).
  2. Configuration:

    • Ensure that the configuration mode is set correctly using the appropriate pins.
    • Use the selected configuration method (Active Serial, Passive Serial, JTAG, etc.) to load the bitstream.
  3. Clocking:

    • Connect the clock signal to the appropriate clock input pin.
    • Ensure the clock frequency does not exceed the maximum specified value (275 MHz).
  4. I/O Usage:

    • Configure the I/O standards as required for your application.
    • Ensure that the I/O banks are powered correctly according to the selected I/O standard.
  5. Thermal Management:

    • Ensure adequate cooling to keep the junction temperature within the operating range.
    • Use a heatsink if necessary, especially in high-power applications.
  6. Handling:

    • Handle the device with care to avoid damage to the pins.
    • Follow ESD (Electrostatic Discharge) precautions to prevent damage to the device.
  7. Storage:

    • Store the device in a dry, cool environment to prevent moisture damage.
    • Follow recommended storage guidelines to ensure long-term reliability.
(For reference only)

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