Description
BUY NTH0512MC https://www.utsource.net/itm/p/8980979.html
| Parameter |
Symbol |
Conditions |
Min |
Typ |
Max |
Unit |
| Rated Voltage |
VR |
Continuous |
- |
50 |
- |
Vdc |
| Peak Current |
IPK |
Pulse Width ≤ 1ms |
- |
2.0 |
- |
A |
| Continuous Current |
IC |
@ TA = 25°C |
- |
0.5 |
- |
A |
| Power Dissipation |
PD |
@ TA = 25°C |
- |
0.625 |
- |
W |
| Junction Temperature |
TJ |
Operating |
-55 |
- |
150 |
°C |
| Storage Temperature |
TSTG |
|
-55 |
- |
150 |
°C |
| Thermal Resistance |
RθJA |
Junction to Ambient |
- |
200 |
- |
°C/W |
Instructions for Use:
- Mounting: Ensure the NTH0512MC is mounted on a suitable heatsink if operating near its maximum power dissipation limits to maintain junction temperature within specified limits.
- Voltage Handling: Do not exceed the rated voltage of 50Vdc continuously to avoid damage to the component.
- Current Limitations: For continuous operation, do not exceed the continuous current rating of 0.5A at an ambient temperature of 25°C. For pulse applications, ensure pulse width does not exceed 1ms and peak current does not exceed 2.0A.
- Temperature Management: Keep the junction temperature between -55°C and 150°C. Monitor the ambient and operating temperatures closely.
- Storage Conditions: Store the component in environments where the temperature ranges from -55°C to 150°C to ensure longevity and performance integrity.
- Thermal Considerations: The thermal resistance (RθJA) is 200°C/W. Design the application to manage heat effectively, especially in high-power or high-temperature environments.
(For reference only)
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