FGH40N60SFD TO-247: Top Choice in United States (USA) Utsource Holding Company Limited

Description

Parameter	Symbol	Min	Typ	Max	Unit	Description
Drain-Source Voltage	V_DS	-	600	-	V	Maximum voltage that can be applied between the drain and source with the gate shorted to the source.
Gate-Source Voltage	V_GS	-20	-	20	V	Maximum voltage that can be applied between the gate and source.
Continuous Drain Current (T_C = 25°C)	I_D	-	40	-	A	Maximum continuous current that can flow through the drain to the source at a case temperature of 25°C.
Continuous Drain Current (T_C = 100°C)	I_D	-	25	-	A	Maximum continuous current that can flow through the drain to the source at a case temperature of 100°C.
Pulse Drain Current (T_C = 25°C, t_p = 10 ms, Duty Cycle = 1%)	I_D(pulse)	-	120	-	A	Maximum pulse current that can flow through the drain to the source at a case temperature of 25°C, with a pulse duration of 10 ms and a duty cycle of 1%.
Power Dissipation (T_C = 25°C)	P_D	-	280	-	W	Maximum power dissipation at a case temperature of 25°C.
Power Dissipation (T_C = 100°C)	P_D	-	180	-	W	Maximum power dissipation at a case temperature of 100°C.
Junction Temperature	T_J	-	-	150	°C	Maximum operating temperature of the junction.
Storage Temperature Range	T_STG	-55	-	150	°C	Temperature range over which the device can be stored without damage.
Total Device Dissipation (T_A = 25°C)	P_TOT	-	300	-	W	Maximum total power dissipation at ambient temperature of 25°C.

Mounting and Handling:
- Ensure proper heat sinking to maintain the junction temperature within the specified limits.
- Handle the device with care to avoid mechanical stress and damage to the leads.
Electrical Connections:
- Connect the drain, source, and gate terminals correctly to avoid damage.
- Use appropriate gate drive circuits to ensure reliable operation.
Thermal Management:
- Ensure adequate cooling to keep the device within its thermal limits, especially during high current or high power dissipation conditions.
- Use thermal paste or thermal interface materials between the device and the heat sink for better thermal conductivity.
Pulse Operation:
- For pulse applications, ensure that the pulse width and duty cycle are within the specified limits to avoid overheating.
Storage:
- Store the device in a dry, cool place within the specified storage temperature range to prevent damage.
Safety Precautions:
- Follow all safety guidelines and precautions when handling and using the device to prevent electrical shock and other hazards.

(For reference only)