Description
BUY MP1471AGJ-Z SOT23-6 https://www.utsource.net/itm/p/8944505.html
| Parameter |
Symbol |
Test Conditions |
Min |
Typ |
Max |
Unit |
| Input Voltage |
VIN |
- |
2.5 |
- |
5.5 |
V |
| Output Voltage |
VOUT |
- |
0.8 |
- |
5.0 |
V |
| Output Current |
IOUT |
- |
- |
1.5 |
2.0 |
A |
| Switching Frequency |
fSW |
- |
1.0 |
1.2 |
1.5 |
MHz |
| Quiescent Current |
IQ |
VIN = 5V, VOUT = 3.3V |
- |
30 |
60 |
μA |
| Shutdown Current |
ISD |
VIN = 5V, SHDN = 0V |
- |
1 |
5 |
μA |
| Efficiency |
η |
VIN = 5V, VOUT = 3.3V |
- |
92 |
- |
% |
| Thermal Shutdown Temperature |
TSD |
- |
- |
160 |
- |
°C |
| Operating Junction Temperature |
TJ |
- |
-40 |
- |
125 |
°C |
Instructions for MP1471AGJ-Z SOT23-6
Input Voltage (VIN):
- Ensure the input voltage is within the range of 2.5V to 5.5V to avoid damage to the device.
Output Voltage (VOUT):
- Set the output voltage using external resistors according to the formula provided in the datasheet. The output voltage can be adjusted from 0.8V to 5.0V.
Output Current (IOUT):
- The typical output current is 1.5A, with a maximum of 2.0A. Ensure the load does not exceed this limit to prevent overheating or damage.
Switching Frequency (fSW):
- The switching frequency is typically 1.2MHz, which helps in reducing the size of external components like inductors and capacitors.
Quiescent Current (IQ):
- The quiescent current is typically 30μA at 5V input and 3.3V output. This low quiescent current helps in improving efficiency.
Shutdown Current (ISD):
- When the shutdown pin (SHDN) is pulled low (0V), the shutdown current is typically 1μA, allowing the device to enter a low-power mode.
Efficiency (η):
- The efficiency is typically 92% at 5V input and 3.3V output. This high efficiency is crucial for power management applications.
Thermal Shutdown (TSD):
- The device will automatically shut down if the junction temperature exceeds 160°C to prevent thermal damage.
Operating Junction Temperature (TJ):
- The operating junction temperature range is from -40°C to 125°C. Ensure the device operates within this range to maintain reliability.
Layout Considerations:
- Use short and wide traces for power connections to minimize parasitic inductance and resistance.
- Place the input and output capacitors as close as possible to the IC to reduce noise and improve stability.
- Ensure proper grounding and decoupling to maintain stable operation and minimize electromagnetic interference (EMI).
Storage and Handling:
- Store the device in a dry environment to prevent moisture damage.
- Handle the device with care to avoid static discharge, which can damage the internal components.
Application Notes:
- Refer to the application notes provided in the datasheet for detailed information on designing circuits with the MP1471AGJ-Z, including component selection and layout guidelines.
(For reference only)
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