TSF30L200C: Top Choice in United States (USA) Utsource Holding Company Limited

Description

Parameter	Symbol	Min	Typ	Max	Unit	Description
Supply Voltage	VDD	2.7	-	5.5	V	Operating voltage range
Supply Current (Active)	IDD	-	2.5	-	mA	Current consumption in active mode
Supply Current (Shutdown)	ISD	-	0.1	-	μA	Current consumption in shutdown mode
Output Type	-	-	-	-	Open Drain	Output configuration
Output Low Voltage	VOL	-	0.4	-	V	Output voltage when low
Output High Impedance	ZOH	-	-	-	Ω	Output impedance when high
Input Threshold Voltage	VIH	2.0	-	5.5	V	Input voltage for logic high
Input Threshold Voltage	VIL	0.8	-	2.0	V	Input voltage for logic low
Operating Temperature	TOPR	-40	-	85	°C	Operating temperature range
Storage Temperature	TSTG	-65	-	150	°C	Storage temperature range
Maximum Junction Temperature	TJMAX	-	-	150	°C	Maximum junction temperature
ESD Rating	HBM	-	-	2000	V	Human Body Model (HBM) ESD rating
Package Type	-	-	-	-	SOT-23	Package type

Power Supply:
- Ensure the supply voltage (VDD) is within the range of 2.7V to 5.5V.
- Connect the VDD pin to the positive supply and GND pin to the ground.
Output Configuration:
- The output is open drain, so an external pull-up resistor is required to define the high state.
- Choose a pull-up resistor value based on the load and desired rise time.
Input Signal:
- Apply input signals within the specified threshold voltages (VIL and VIH).
- Ensure the input signal is stable and noise-free to avoid false triggering.
Temperature Considerations:
- Operate the device within the temperature range of -40°C to 85°C.
- Store the device within the temperature range of -65°C to 150°C.
ESD Protection:
- Handle the device with care to avoid damage from electrostatic discharge.
- Use proper ESD protection measures during handling and assembly.
Shutdown Mode:
- To enter shutdown mode, set the enable pin to a low state.
- In shutdown mode, the current consumption drops to approximately 0.1 μA.
Mounting and Handling:
- Follow standard surface mount technology (SMT) guidelines for mounting the SOT-23 package.
- Avoid excessive thermal stress during soldering.
Testing:
- Before final assembly, test the device under typical operating conditions to ensure proper functionality.
- Verify the output behavior with and without the pull-up resistor.

(For reference only)