Description
BUY BCW30LT1 https://www.utsource.net/itm/p/11274721.html
BCW30LT1 PNP transistors(BJT) -32V -100mA/-0.1A 215~500 -300mV/-0.3V SOT-23/SC-59 marking C2
Parameter |
Symbol |
Min |
Typ |
Max |
Unit |
Description |
Supply Voltage |
VDD |
-0.3 |
|
5.5 |
V |
Maximum supply voltage |
Output Current |
IO |
|
100 |
|
mA |
Continuous output current |
Operating Temp. |
TA |
-40 |
|
85 |
°C |
Ambient operating temperature range |
Storage Temp. |
TSTG |
-65 |
|
150 |
°C |
Storage temperature range |
Quiescent Current |
IQ |
|
20 |
|
μA |
Quiescent current at 5V |
Output Voltage |
VO |
|
|
0.2 |
V |
Output voltage drop (low level) |
Output Voltage |
VO |
|
|
0.1 |
V |
Output voltage rise (high level) |
Input Capacitance |
CIN |
|
|
10 |
pF |
Input capacitance |
Output Capacitance |
COUT |
|
|
10 |
pF |
Output capacitance |
Instructions for Using BCW30LT1
Supply Voltage:
- Ensure the supply voltage is within the specified range of -0.3V to 5.5V to avoid damage to the device.
Output Current:
- The device can provide up to 100mA of continuous output current. Exceeding this limit may cause overheating or damage.
Operating Temperature:
- The device operates reliably within an ambient temperature range of -40°C to 85°C. Avoid exposing the device to temperatures outside this range during operation.
Storage Temperature:
- Store the device in an environment with a temperature range of -65°C to 150°C to ensure long-term reliability.
Quiescent Current:
- The quiescent current is typically 20μA at a supply voltage of 5V. This value helps in power consumption calculations for low-power applications.
Output Voltage:
- When the output is low, the voltage drop should not exceed 0.2V.
- When the output is high, the voltage rise should not exceed 0.1V.
Capacitance:
- The input and output capacitance should be kept below 10pF to maintain proper signal integrity and performance.
Handling:
- Handle the device with care to avoid static discharge and physical damage.
- Use appropriate ESD protection measures when handling the device.
Mounting:
- Follow standard surface mount technology (SMT) guidelines for mounting the device on a PCB.
- Ensure proper soldering and avoid excessive heat during the soldering process.
Testing:
- Before finalizing the design, perform thorough testing under various conditions to ensure the device meets all performance specifications.
(For reference only)
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