BCW30LT1

BCW30LT1

Category: Diodes Available (Qty:9999999)
For more information, visit our official website at utsource.us

Description

BUY BCW30LT1 https://www.utsource.net/itm/p/11274721.html
BCW30LT1 PNP transistors(BJT) -32V -100mA/-0.1A 215~500 -300mV/-0.3V SOT-23/SC-59 marking C2

Parameter Symbol Min Typ Max Unit Description
Supply Voltage VDD -0.3 5.5 V Maximum supply voltage
Output Current IO 100 mA Continuous output current
Operating Temp. TA -40 85 °C Ambient operating temperature range
Storage Temp. TSTG -65 150 °C Storage temperature range
Quiescent Current IQ 20 μA Quiescent current at 5V
Output Voltage VO 0.2 V Output voltage drop (low level)
Output Voltage VO 0.1 V Output voltage rise (high level)
Input Capacitance CIN 10 pF Input capacitance
Output Capacitance COUT 10 pF Output capacitance

Instructions for Using BCW30LT1

  1. Supply Voltage:

    • Ensure the supply voltage is within the specified range of -0.3V to 5.5V to avoid damage to the device.
  2. Output Current:

    • The device can provide up to 100mA of continuous output current. Exceeding this limit may cause overheating or damage.
  3. Operating Temperature:

    • The device operates reliably within an ambient temperature range of -40°C to 85°C. Avoid exposing the device to temperatures outside this range during operation.
  4. Storage Temperature:

    • Store the device in an environment with a temperature range of -65°C to 150°C to ensure long-term reliability.
  5. Quiescent Current:

    • The quiescent current is typically 20μA at a supply voltage of 5V. This value helps in power consumption calculations for low-power applications.
  6. Output Voltage:

    • When the output is low, the voltage drop should not exceed 0.2V.
    • When the output is high, the voltage rise should not exceed 0.1V.
  7. Capacitance:

    • The input and output capacitance should be kept below 10pF to maintain proper signal integrity and performance.
  8. Handling:

    • Handle the device with care to avoid static discharge and physical damage.
    • Use appropriate ESD protection measures when handling the device.
  9. Mounting:

    • Follow standard surface mount technology (SMT) guidelines for mounting the device on a PCB.
    • Ensure proper soldering and avoid excessive heat during the soldering process.
  10. Testing:

    • Before finalizing the design, perform thorough testing under various conditions to ensure the device meets all performance specifications.
(For reference only)

More detail about Utsource Holding Company Limited
Utsource Holding Company Limited
Utsource Holding Company Limited Electronic Component Wholesaler, IC Chip Distributor, IGBT Module Supplier in California, USA | Utsource Holding Company Limited