Diodes
MC74VHC1GT14DFT2
MC74VHC1GT14DFT2

 

MC74VHC1GT14DFT2

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Category: Diodes Available (Qty:9999999)
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Description

BUY MC74VHC1GT14DFT2 https://www.utsource.net/itm/p/11284102.html
Integrated Circuit(IC) Inverting Schmitt trigger MC74VHC1GT14DFT2 SOT-353/SC-88A/SC70-5 marking VC4

Parameter Symbol Min Typ Max Unit
Supply Voltage VCC 2.0 - 5.5 V
Input Low Voltage VIL - - 0.8 V
Input High Voltage VIH 2.0 - - V
Output Low Voltage VOL - 0.1 0.4 V
Output High Voltage VOH 2.4 - - V
Propagation Delay Time tpd - 6 13 ns
Power Dissipation PD - - 100 mW
Operating Temperature Range TA -40 - 85 °C
Storage Temperature Range TSTG -65 - 150 °C

Instructions for Use

  1. Supply Voltage (VCC):

    • Ensure the supply voltage is within the range of 2.0V to 5.5V.
    • Avoid exceeding the maximum voltage to prevent damage to the device.

  2. Input Voltage Levels:

    • For a valid low input, the voltage should be less than or equal to 0.8V.
    • For a valid high input, the voltage should be greater than or equal to 2.0V.

  3. Output Voltage Levels:

    • The output low voltage (VOL) will typically be around 0.1V to 0.4V.
    • The output high voltage (VOH) will typically be at least 2.4V.

  4. Propagation Delay Time (tpd):

    • The typical propagation delay time is 6ns, with a maximum of 13ns.
    • This value can vary depending on the specific operating conditions.

  5. Power Dissipation (PD):

    • The maximum power dissipation is 100mW. Ensure adequate heat dissipation to avoid overheating.

  6. Operating Temperature Range (TA):

    • The device is designed to operate within a temperature range of -40°C to 85°C.
    • Avoid operating outside this range to ensure reliable performance.

  7. Storage Temperature Range (TSTG):

    • The device can be stored in temperatures ranging from -65°C to 150°C.
    • Store the device in a dry, cool place to maintain its integrity.

  8. Handling and Installation:

    • Handle the device with care to avoid static discharge.
    • Follow standard ESD (Electrostatic Discharge) precautions during handling and installation.
    • Ensure proper soldering techniques to avoid thermal stress on the device.

  9. Pin Configuration:

    • Refer to the datasheet for the specific pin configuration and connections.
    • Ensure all pins are correctly connected to their respective signals and power supplies.

  10. Testing and Verification:

    • After installation, verify the functionality of the device using appropriate test equipment.
    • Check for correct voltage levels and signal timing to ensure proper operation.
(For reference only)

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