BF569

BF569

Category: Diodes Available (Qty:9999999)
For more information, visit our official website at utsource.us

Description

BUY BF569 https://www.utsource.net/itm/p/11284792.html
BF569 PNP transistors(BJT) -40V -30mA 1GHz 25~90 -10V SOT-23/SC-59 marking LH self oscillating RFmixer

Parameter Symbol Min Typical Max Unit
Supply Voltage VDD 2.7 - 3.6 V
Operating Temperature Toper -40 - 85 °C
Storage Temperature Tstg -65 - 150 °C
Maximum Junction Temp. Tj(max) - - 150 °C
Output Current Iout - 100 200 mA
Input Capacitance Cin - 10 - pF
Output Capacitance Cout - 5 - pF
Rise Time tr - 10 - ns
Fall Time tf - 10 - ns
Propagation Delay tpdl - 5 - ns

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (VDD) is within the range of 2.7V to 3.6V.
    • Use appropriate decoupling capacitors (e.g., 0.1μF ceramic capacitors) close to the power pins to minimize noise.
  2. Temperature Considerations:

    • The operating temperature range is from -40°C to 85°C.
    • Store the device in an environment with temperatures between -65°C and 150°C.
    • Do not exceed the maximum junction temperature of 150°C during operation.
  3. Output Current:

    • The typical output current is 100mA, with a maximum of 200mA.
    • Ensure that the load does not draw more than the maximum output current to avoid damage.
  4. Capacitance:

    • The input capacitance (Cin) is typically 10pF.
    • The output capacitance (Cout) is typically 5pF.
    • These values should be considered when designing the circuit to ensure stability and performance.
  5. Timing Parameters:

    • The rise time (tr) and fall time (tf) are both typically 10ns.
    • The propagation delay (tpdl) is typically 5ns.
    • These timing parameters are crucial for ensuring proper signal integrity and timing in your design.
  6. Handling:

    • Handle the device with care to avoid static discharge.
    • Follow standard ESD (Electrostatic Discharge) precautions during handling and installation.
  7. Mounting:

    • Ensure proper soldering techniques are used to avoid thermal and mechanical stress.
    • Follow the recommended PCB layout guidelines provided by the manufacturer for optimal performance.
  8. Testing:

    • Test the device under the specified operating conditions to ensure it meets the required specifications.
    • Use appropriate test equipment and methods to validate the performance of the device.
(For reference only)

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