Description
BUY BF569 https://www.utsource.net/itm/p/11284792.html
BF569 PNP transistors(BJT) -40V -30mA 1GHz 25~90 -10V SOT-23/SC-59 marking LH self oscillating RFmixer
| Parameter |
Symbol |
Min |
Typical |
Max |
Unit |
| Supply Voltage |
VDD |
2.7 |
- |
3.6 |
V |
| Operating Temperature |
Toper |
-40 |
- |
85 |
°C |
| Storage Temperature |
Tstg |
-65 |
- |
150 |
°C |
| Maximum Junction Temp. |
Tj(max) |
- |
- |
150 |
°C |
| Output Current |
Iout |
- |
100 |
200 |
mA |
| Input Capacitance |
Cin |
- |
10 |
- |
pF |
| Output Capacitance |
Cout |
- |
5 |
- |
pF |
| Rise Time |
tr |
- |
10 |
- |
ns |
| Fall Time |
tf |
- |
10 |
- |
ns |
| Propagation Delay |
tpdl |
- |
5 |
- |
ns |
Instructions for Use:
Power Supply:
- Ensure the supply voltage (VDD) is within the range of 2.7V to 3.6V.
- Use appropriate decoupling capacitors (e.g., 0.1μF ceramic capacitors) close to the power pins to minimize noise.
Temperature Considerations:
- The operating temperature range is from -40°C to 85°C.
- Store the device in an environment with temperatures between -65°C and 150°C.
- Do not exceed the maximum junction temperature of 150°C during operation.
Output Current:
- The typical output current is 100mA, with a maximum of 200mA.
- Ensure that the load does not draw more than the maximum output current to avoid damage.
Capacitance:
- The input capacitance (Cin) is typically 10pF.
- The output capacitance (Cout) is typically 5pF.
- These values should be considered when designing the circuit to ensure stability and performance.
Timing Parameters:
- The rise time (tr) and fall time (tf) are both typically 10ns.
- The propagation delay (tpdl) is typically 5ns.
- These timing parameters are crucial for ensuring proper signal integrity and timing in your design.
Handling:
- Handle the device with care to avoid static discharge.
- Follow standard ESD (Electrostatic Discharge) precautions during handling and installation.
Mounting:
- Ensure proper soldering techniques are used to avoid thermal and mechanical stress.
- Follow the recommended PCB layout guidelines provided by the manufacturer for optimal performance.
Testing:
- Test the device under the specified operating conditions to ensure it meets the required specifications.
- Use appropriate test equipment and methods to validate the performance of the device.
(For reference only)
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