SI2301BDS: Top Choice in United States (USA) Utsource Holding Company Limited

Description

BUY SI2301BDS https://www.utsource.net/itm/p/11287142.html
SI2301BDS MOSFET P-Channel -20V -2.4A 0.080ohm SOT-23 marking L1

Parameter	Symbol	Min	Typ	Max	Unit	Description
Drain-Source Voltage	V_DS	-55		55	V	Maximum voltage between drain and source
Gate-Source Voltage	V_GS	-8		8	V	Maximum voltage between gate and source
Continuous Drain Current	I_D		4.2		A	Continuous current through the drain
Pulse Drain Current	I_D(pulse)		10		A	Peak pulse current through the drain (t_p = 100 μs)
Power Dissipation	P_D		2.1		W	Maximum power dissipation at T_A = 25°C
Junction Temperature	T_J	-40		150	°C	Operating junction temperature range
Storage Temperature	T_STG	-65		150	°C	Temperature range for storage
Thermal Resistance	R_θJC		35		°C/W	Junction-to-case thermal resistance
Gate Charge	Q_G		9.5		nC	Total gate charge
Input Capacitance	C_iss		300		pF	Input capacitance at V_DS = 10V
Output Capacitance	C_oss		40		pF	Output capacitance at V_DS = 10V
Reverse Transfer Capacitance	C_rss		12		pF	Reverse transfer capacitance at V_DS = 10V

Handling and Storage:
- Store the device in a dry, cool place within the specified storage temperature range.
- Handle with care to avoid mechanical stress and static discharge.
Mounting:
- Ensure proper heat sinking if operating near maximum power dissipation.
- Use recommended PCB layout guidelines to minimize parasitic inductances and capacitances.
Biasing:
- Apply the gate-source voltage (V_GS) carefully to avoid exceeding the maximum ratings.
- Ensure that the gate is properly biased to control the drain current (I_D).
Operating Conditions:
- Monitor the junction temperature (T_J) to ensure it stays within the safe operating range.
- Do not exceed the continuous or pulse drain current ratings to prevent damage.
Testing:
- Use appropriate test equipment and methods to measure parameters such as gate charge and capacitances.
- Follow safety guidelines when testing high-voltage and high-current circuits.
Soldering:
- Use a soldering iron with a controlled temperature to avoid thermal shock.
- Follow the recommended soldering profile provided by the manufacturer.
Applications:
- Suitable for switching applications in power supplies, motor control, and other high-frequency circuits.
- Ensure the device is used within its specified electrical and thermal limits for reliable performance.

(For reference only)