TC7W08F

TC7W08F

Category: Diodes Available (Qty:9999999)
For more information, visit our official website at utsource.us

Description

BUY TC7W08F https://www.utsource.net/itm/p/11288916.html
Integrated Circuit(IC) AND gate TC7W08F FM8 marking 7W08F

Parameter Symbol Min Typical Max Unit
Supply Voltage VDD 2.5 - 5.5 V
Output Current (High) IOH - 16 - mA
Output Current (Low) IOL - 32 - mA
Input Leakage Current IIH - 1 10 μA
Input Low Voltage VIL 0 - 0.8 V
Input High Voltage VIH 2.0 - VDD V
Propagation Delay Time tPD - 10 30 ns
Power Dissipation PD - - 400 mW
Operating Temperature Toper -40 - 85 °C
Storage Temperature Tstg -65 - 150 °C

Instructions for Use:

  1. Supply Voltage (VDD):

    • Ensure the supply voltage is within the range of 2.5V to 5.5V.
    • Avoid exceeding the maximum supply voltage to prevent damage to the device.
  2. Output Current:

    • The device can source up to 16mA (IOH) and sink up to 32mA (IOL).
    • Do not exceed these current limits to avoid overheating or damage.
  3. Input Signals:

    • Input signals should be within the specified input low (VIL) and input high (VIH) voltage ranges.
    • Ensure that the input leakage current (IIH) does not exceed 10μA to maintain proper operation.
  4. Propagation Delay:

    • The typical propagation delay time (tPD) is 10ns, with a maximum of 30ns.
    • This parameter is crucial for timing considerations in your circuit design.
  5. Power Dissipation:

    • The maximum power dissipation (PD) is 400mW.
    • Ensure adequate heat sinking if operating near this limit to prevent thermal damage.
  6. Temperature Range:

    • The operating temperature range (Toper) is from -40°C to 85°C.
    • The storage temperature range (Tstg) is from -65°C to 150°C.
    • Store and operate the device within these temperature limits to ensure reliability.
  7. Handling:

    • Handle the device with care to avoid static discharge, which can damage sensitive components.
    • Follow proper ESD (Electrostatic Discharge) precautions when handling the device.
  8. Mounting:

    • Ensure proper mounting on the PCB to avoid mechanical stress.
    • Follow the recommended soldering profile and reflow temperatures provided by the manufacturer.
(For reference only)

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