KGF25N120KDA 25N120 KEC 25A 1200V: Top Choice in United States (USA) Utsource Holding Company Limited

Description

Parameter	Symbol	Min	Typ	Max	Unit	Description
Drain-Source On-State Resistance	R_DS(on)	-	180	-	mΩ @ V_GS=10V, I_D=25A	Resistance when the MOSFET is fully on
Drain-Source Breakdown Voltage	V_DS(BR)	-	1200	-	V	Maximum voltage that can be applied between drain and source without damaging the device
Gate-Source Threshold Voltage	V_GS(th)	3	4	5	V	Minimum gate-to-source voltage required to start turning on the MOSFET
Continuous Drain Current	I_D	-	25	-	A	Maximum continuous current that can flow through the drain to source
Pulse Drain Current (t_p=10ms)	I_Dm	-	100	-	A	Maximum pulse current that can flow through the drain to source for a short duration
Total Power Dissipation	P_TOT	-	250	-	W	Maximum power that can be dissipated by the device under specified conditions
Junction Temperature	T_J	-	-	175	°C	Maximum allowable temperature of the junction
Storage Temperature Range	T_STG	-55	-	150	°C	Temperature range over which the device can be stored without damage
Operating Temperature Range	T_A	-55	-	150	°C	Ambient temperature range over which the device can operate reliably

Handling and Storage:
- Store the device in a dry, cool place.
- Handle with care to avoid damage to the leads and body.
- Use ESD (Electrostatic Discharge) protection when handling the device.
Mounting:
- Ensure proper heat sinking to manage the power dissipation.
- Use recommended mounting torque for the screws to avoid mechanical stress.
- Ensure good thermal contact between the device and the heatsink.
Operation:
- Do not exceed the maximum ratings listed in the table.
- Ensure that the gate-source voltage (V_GS) does not exceed the threshold voltage to prevent damage.
- Operate within the specified temperature ranges to ensure reliable performance.
Testing:
- Use appropriate test equipment and methods to measure parameters.
- Follow safety guidelines to prevent electrical shock and damage to the device.
Soldering:
- Use a soldering iron with a temperature-controlled tip.
- Solder quickly to avoid overheating the device.
- Allow the device to cool down before applying power.
Troubleshooting:
- If the device fails to operate correctly, check for proper connections and power supply.
- Verify that the gate drive circuit is functioning correctly.
- Check for any signs of physical damage or overheating.

(For reference only)