DY-256C is a micro infrared thermal imaging module of the latest generation, with a very small size due to its high density integrated circuit design.
It adopts split-type design, the lens and interface board are connected by flat cable, plus a wafer-grade vanadium oxide detector with very low power consumption.
The module is integrated with 3.2mm lens and shutter, equipped with USB interface board, so it can be developed into different devices.
Control protocol or SDK is also provided for secondary development.
Malaysia
