Accelerate your hardware development with our 80mm x 65mm Universal Prototype PCB Board. This mid-sized dot-matrix board is an essential tool for engineers, students, and makers, providing a reliable platform for permanent circuit assembly and hardware testing in a compact form factor. Designed with a high-density grid of pre-drilled, tinned holes, this board supports a wide range of through-hole components for clean and professional results.
Versatile Mid-Size Dimensions: The 80mm x 65mm footprint offers a balanced workspace ideal for small-to-medium circuit designs and sensor modules.
Double-Sided Connectivity: Features tinned copper pads on both surfaces, enabling complex routing and component mounting on either side of the board.
Integrated Edge Connectors: Includes specialized contact pads along the top edge, perfect for power distribution or interfacing with external bus systems.
Precision Coordinate System: Clearly labeled alphanumeric markings (A–Y and 1–32) facilitate accurate component placement and rapid circuit mapping.
Robust Substrate Material: Manufactured from high-quality heat-resistant material to prevent pad lifting and warping during intensive soldering.
The BNK-02 Series prototype board is specifically built to bridge the gap between temporary breadboarding and custom manufactured PCBs. Its sturdy construction and high-quality tinned finish ensure long-lasting durability for custom laboratory tools, interface modules, and sophisticated DIY electronics projects.
Dimensions: 80mm x 65mm.
Is the hole spacing compatible with standard components?
Yes, this board features standard 2.54mm (0.1") pitch spacing, making it perfectly compatible with most ICs, headers, and discrete electronic components.
Can I securely mount this board?
Absolutely. The board is designed with pre-drilled holes in all four corners, allowing for easy mounting using standard standoffs or screws.
How durable are the solder pads?
The pads are high-quality tinned copper, designed to withstand the heat of professional soldering without delaminating from the substrate.
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