BUY 74HC4052D SOIC-16 https://www.utsource.net/itm/p/8646931.html
| Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Supply Voltage | VCC | 2.0 | 6.0 | V | ||
| Output Low Leakage | IOZL | VI = 0V, TA = 25°C | -1.0 | 1.0 | μA | |
| Input Leakage Current | IIL | VI = VCC, TA = 25°C | -1.0 | 1.0 | μA | |
| Propagation Delay Time | tpd | VCC = 4.5V to 5.5V, TA = 25°C | 20 | ns | ||
| Power Dissipation | PD | Continuous, per package | 390 | mW | ||
| Operating Temperature | TA | -40 | 85 | °C |
Power Supply Connection: Connect the supply voltage (VCC) within the specified range of 2.0V to 6.0V. Ensure a stable power supply to avoid unexpected behavior.
Signal Inputs and Outputs: Verify that input signals do not exceed the supply voltage levels to prevent damage to the device. The output low leakage and input leakage currents should be kept within the specified limits to maintain optimal performance.
Propagation Delay: Be aware of the propagation delay time when designing circuits, especially in high-speed applications. This ensures accurate timing in signal processing.
Thermal Considerations: Monitor the operating temperature and ensure it stays within the -40°C to 85°C range. Exceeding these temperatures can lead to unreliable operation or failure.
Mounting and Handling: Handle the SOIC-16 package with care during mounting to avoid mechanical damage. Follow standard soldering practices suitable for surface-mount devices.
Power Dissipation: Keep the power dissipation within the limit of 390mW to ensure reliable operation and prevent overheating.
Storage: Store the device in a dry environment and follow ESD protection guidelines to prevent damage from static electricity.
