PCT HAST Pressure Aging Test Chamber
An advanced accelerated life testing solution designed to evaluate the moisture resistance and reliability of semiconductor packaging. By subjecting components to severe temperature, humidity, and pressure, it effectively simulates long-term environmental exposure to detect potential failures like circuit breakage or active metallization.
Product Overview
Technical Highlights
- Steam Temp Range100°C ~ 135°C (143°C Opt)
- Steam Humidity70% ~ 100% R.H.
- Recursive DeviceForced-circulation Steam
- Safety FeatureAuto-discharge Pressure
- ProtectionOver-pressure & Water Short
Safety & Hardware
- Internal PlateDual-layer Stainless Steel
- Water SupplyAuto/Manual Replenishing
- Pressure ControlOver-pressure Protection
- CirculationForced Steam recursive
- Water ManagementShort-storage Alert
Performance Advantages
Highly Accelerated Stress
Significantly reduces testing cycles by using high-pressure steam to force moisture infiltration into packaging bodies.
Precision Humidity Control
Adjustable steam humidity from 70% to 100% R.H. provides a tailored environment for diverse semiconductor tolerances.
Comprehensive Safety
Features automated pressure discharge and water shortage protection for secure, unattended laboratory operation.
Forced Steam Circulation
The recursive steam device ensures uniform temperature and moisture distribution throughout the testing chamber.
Core Hardware
Technical Specifications
| Name | Hast Accelerated Pressure Aging Test Machine | ||
|---|---|---|---|
| Model | HAST - 35 | HAST - 45 | HAST - 55 |
| Internal Dimension ФxD (mm) |
350x450 | 450x550 | 550x650 |
| External Dimension (mm) |
W900xH1350xD900mm | W1000xH1480xD1000 | W1150xH1650xD1200 |
| Steam Temperature Range | Steam Temperature Range: 100°C~135°C, (143°C is optional) | ||
| Steam Humidity | 70~100% R.H. steam humidity adjustable | ||
| Recursive Device | Steam in forced-circulation | ||
| Safety Protective Device | Water short storage protect, over pressure protect. (have automatically/manual water replenishing, automatically discharge pressure function) | ||
| Accessories | Two layers stainless steel plate | ||
Primary Applications
Semiconductor Testing
Evaluating moisture resistance of IC packaging, semiconductor dyes, and lead frames.
Failure Analysis
Identifying active metallization and contamination-based short circuits between package leads.
Accelerated Aging
Simulating years of environmental humidity and heat exposure in a matter of hours.
