Type | 3DeVOK MQ | |||
Light Sources 22 | Infrared Laser Lines [Invisible] | Infrared VCSEL Structured Light [Invisible] | ||
Class of Lasers | Class Ⅰ (Eye-safe) | |||
Scan Modes | Infrared Laser Lines | Infrared Linear-array Structured Light (Speckle) | ||
Supports markerless and invisible-light scanning | Supports markerless scanning, invisible-light scanning, partial fine scanning, and rapid scanning at ultra-long-distance range and ultra-large FoV | |||
Wireless Scanning | Support (with an optional handle) | |||
Accuracy* | Up to 0.08 mm | |||
Point Distance | 0.1-5 mm | |||
Alignment Mode | Support hybrid, markers, texture, | Support hybrid, texture, and geometric features alignment | ||
and geometric features alignment | ||||
Ability to Capture Texture | Yes | |||
Scanning Distance | 150-1,000 mm | 150-1,500 mm | ||
Field of View | 140 mm × 140 mm - 490 mm × 490 mm | 50 mm × 75 mm - 1,100mm × 1,000mm | ||
Scanning Frame | Up to 70 FPS (Marker alignment) | Up to 30 FPS | ||
Scanning Speed | Up to 2,450,000 Points/s | Up to 4,500,000 Points/s | ||
Output Formats | *.obj, *.stl, *.ply, *.asc, *.mk2, *.txt, *.epj, *.apj, *.spj, *.map, *.sk | |||
The Ability for 3D Printing | Supports .stl, .obj and other formats | |||
Wireless Scanning | Support (with an optional handle) | |||
Working Temperature Range | 0 - 40 ℃ | |||
Working Humidity Range | 10% - 90% RH (Non-condensing) | |||
Interface | USB 3.0 | |||
Scanner Dimensions & Weight | Dimensions: 215 mm × 73 mm × 53 mm; Weight: 550 g | |||
Power Source | DC: 12 V, 5.0 A | |||
Certifications | CE-EMC, FCC, RoHS, IEC 60825, IEC 62471, IEC 60529-IP50, WEEE, KC | |||
Recommended Configurations for PC | OS: Win10/Win11, 64-bit; CPU: i7-13650HX and above; RAM: 32GB and above; | |||
Graphic Card: NVIDIA discrete graphics card, NVIDIA RTX3060 and above; Graphics memory: 6GB and above |